Pre-Loaded Bowl Mechanism for Symmetric RF Return Path

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional semiconductor processing systems face inefficiencies in substrate handling and processing due to inadequate transfer systems, leading to reduced throughput and potential thermal non-uniformity and particle contamination, especially as cluster tools scale and additional processing chambers are added.

Innovation Solution

The introduction of a substrate processing system with a translatable bowl and metallic straps that form a dynamic radio frequency circuit, allowing for efficient substrate transfer and processing while minimizing particle generation and thermal issues, and enabling single-technician installation and maintenance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional wafer transfer systems are used in scaled cluster tools, then substrate handling is achieved, but throughput is reduced and thermal non-uniformity occurs

Engineering Contradiction:

Improvesubstrate throughputVSAvoidthermal uniformity

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The substrate support is made dynamically translatable between process and transfer positions, with the bowl component dynamically engaging and disengaging from the liner. This dynamic configuration allows the system to optimize for either processing (improving thermal uniformity) or transfer (improving throughput) as needed, resolving the contradiction between these two requirements

Inventive Principle:

Principle #15Dynamics

2Productivity

If additional processing chambers are added to scale cluster tools, then processing capacity increases, but particle contamination increases

Engineering Contradiction:

Improveprocessing capacityVSAvoidparticle contamination

Core Design Contradiction:

ProductivityVSObject-generated harmful factors

Solution Approach 1:

The bowl is extracted as a separate, removable component that can be easily removed and replaced. This allows for quick changeout and cleaning of the bowl component that直接接触 substrates, minimizing particle contamination while maintaining the benefits of scaled cluster tool processing capacity

Inventive Principle:

Principle #2Taking out (Extraction)

3Manufacturing precision

If complex substrate support mechanisms are used, then processing precision is improved, but installation and maintenance difficulty increases

Engineering Contradiction:

Improveprocessing precisionVSAvoidinstallation ease

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The substrate support is segmented into distinct components (support plate, shaft, bowl, springs, straps) that can be independently manufactured, assembled, and replaced. This segmentation maintains processing precision through precise component design while dramatically simplifying installation and maintenance, as individual components can be replaced without disassembling the entire system

Inventive Principle:

Principle #1Segmentation

4Stability of the object's composition

If the substrate support remains in contact with the liner during transfer, then structural stability is maintained, but particle generation increases

Engineering Contradiction:

Improvestructural stabilityVSAvoidparticle generation

Core Design Contradiction:

Stability of the object's compositionVSObject-generated harmful factors

Solution Approach 1:

The contact between the bowl and liner is made dynamic rather than continuous. The bowl engages with the liner during processing to maintain stability, but disengages during transfer operations to minimize particle generation. This dynamic engagement/disengagement resolves the contradiction between maintaining structural stability and minimizing particle generation

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances substrate throughput, reduces particle contamination, and improves on-wafer radial uniformity by creating a closed radio frequency circuit during processing and opening it during transfer, facilitating efficient and precise handling within a scaled cluster tool environment.

Implementation Method 1

a closed radio frequency circuit is formed between the radio frequency source, the substrate support, the plurality of straps, the liner, and the faceplate

Methodology Applied

Scientific EffectRadio frequency current conduction: Conduction (electrical)

Implementation Method 2

a plurality of springs that push the bowl upward as the substrate support is translated to the process position

Methodology Applied

Scientific EffectElastic force: Elasticity

Data Source

PatentUS11887884B2Pre-loaded bowl mechanism for providing a symmetric radio frequency return path

Publication Date: 2024.01.30 APPLIED MATERIALS INC

AI summary

Exemplary substrate processing systems may include a body that defines processing and transfer regions. The systems may include a liner atop the body. The systems may include a faceplate atop the liner. The systems may include a support within the body. The support may be vertically translatable between process and transfer positions. The support may include a plate having a heater. The support may include a shaft coupled with the plate. The support may include a bowl about the shaft below the plate. The bowl may be in alignment with the liner. The support may include springs that push the bowl upward as the support translates to the process position. The support may include straps that couple the plate and bowl. The support may include a hard stop. The bowl may contact the liner in the process position and may be spaced apart from the liner in the transfer position.