Pre-Mold Substrate Groove Layout for Warpage Prevention
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Solution Overview
Problem
Existing pre-mold substrates face challenges in preventing warpage due to differences in thermal expansion coefficients between the base member and the pre-mold resin, which can affect the manufacturing process and quality of semiconductor packages.
Innovation Solution
A pre-mold substrate is designed with an electroconductive base member featuring first and second pre-mold grooves on its bottom and top surfaces, respectively, filled with first and second pre-mold resins of the same type, which helps in minimizing thermal expansion coefficient differences and preventing warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If pre-mold resin is disposed only on the bottom surface of the lead frame, then the manufacturing process is simplified, but warpage of the pre-mold substrate occurs due to thermal expansion coefficient differences
Solution Approach 1:
The pre-mold resin is segmented into two separate components: first pre-mold resin disposed in grooves on the bottom surface and second pre-mold resin disposed in grooves on the top surface. This segmentation allows each resin layer to independently compensate for thermal expansion stresses, preventing warpage while maintaining manufacturing simplicity through the use of standard groove-forming techniques.
Solution Approach 2:
The solution transitions from a single-dimensional approach (resin only on bottom surface) to a bidimensional approach by adding resin layers on both the bottom and top surfaces of the lead frame. This dimensional expansion creates a balanced structure that counteracts thermal expansion coefficient differences from both directions, effectively preventing substrate warpage.
2Stability of the object's composition
If pre-mold resin is disposed on both bottom and top surfaces, then warpage is prevented, but device complexity increases
Solution Approach 1:
Instead of uniformly covering the entire surfaces, the pre-mold resin is strategically placed only in grooves at specific locations on the bottom and top surfaces. This localized approach maintains the structural simplicity of the lead frame while providing targeted warpage prevention where thermal expansion stresses are most critical, thus avoiding unnecessary complexity.
3Stability of the object's composition
If pre-mold resin is disposed on both surfaces, then structural integrity is maintained, but manufacturing precision requirements increase
Solution Approach 1:
The grooves for receiving the pre-mold resin are formed in advance during the lead frame manufacturing process, before the resin disposal step. This preliminary action ensures that the groove dimensions and positions are precisely controlled through established manufacturing processes, reducing the precision requirements for the subsequent resin disposal operation and maintaining structural integrity without excessively increasing manufacturing difficulty.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The arrangement of pre-mold resins on both surface sides of the base member effectively prevents warpage of the pre-mold substrate, enhancing the manufacturing process and the quality of semiconductor packages by maintaining structural integrity.
Implementation Method 1
warpage of a pre-mold substrate may be prevented
Data Source
AI summary
According to an aspect of the present disclosure, there is provided a pre-mold substrate including an electroconductive base member, which includes a first pre-mold groove formed in a bottom surface and a second pre-mold groove formed in a top surface and constitutes a circuit pattern; a first pre-mold resin disposed in the first pre-mold groove; and a second pre-mold resin disposed in the second pre-mold groove.