Pre-Molded Signal Distribution Assembly for Lower Die Stress
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Solution Overview
Problem
Current semiconductor device assemblies with power transistors face limitations in thermal performance and mechanical stress, particularly due to single-sided cooling, which can lead to increased damage and reduced reliability of semiconductor die under increasing power requirements and operating temperatures.
Innovation Solution
The implementation of a semiconductor device module with a pre-molded signal distribution assembly and a thermally conductive ceramic layer, allowing for dual-sided cooling and reduced mechanical stress through a metal-insulator-metal (MIM) stacked structure or substrate bonded ceramic (SBC) assemblies, which expose contact surfaces of conductive posts through a molding compound and utilize a thermally conductive adhesive.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If single-sided cooling is used in semiconductor device assemblies, then the assembly structure is simple, but thermal performance deteriorates and mechanical stress increases causing die damage
Solution Approach 1:
The patent transitions from single-sided cooling to dual-sided cooling by adding a second cooling interface on the opposite side of the semiconductor die. This dimensional change in the cooling architecture allows heat to be dissipated from both sides of the die simultaneously, improving thermal performance and reducing thermal stress on the die while maintaining structural integrity
Solution Approach 2:
The patent employs composite material structures including metal-insulator-metal (MIM) stacked configurations and substrate bonded ceramic assemblies. These composite structures provide both thermal management capabilities and mechanical stress relief, combining materials with different thermal and mechanical properties to simultaneously improve heat dissipation and reduce die stress
2Power
If power requirements and operating temperatures increase, then device power capability improves, but die damage from stress and strain energy increases
Solution Approach 1:
The patent modifies key parameters including thermal resistance through dual-sided cooling architecture and mechanical stress distribution through MIM stacked structures. By changing these parameters, the system can handle higher power and operating temperatures while reducing the harmful effects of stress and strain energy on the semiconductor die
3Temperature
If dual-sided cooling is implemented, then thermal performance improves, but device complexity increases
Solution Approach 1:
The patent segments the cooling function into two independent cooling interfaces, one on each side of the semiconductor die. This segmentation allows each cooling side to be optimized independently and simplifies the overall thermal management architecture by distributing the cooling load across two separate pathways rather than requiring a single complex cooling system
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances thermal performance by reducing thermal resistance and mechanical stress, improving solder joint reliability, and decreasing die tensile stress, thereby reducing the occurrence of die cracking and enhancing overall module reliability.
Implementation Method 1
a thermally conductive ceramic layer coupled with the first side of the second metal layer
Implementation Method 2
coupled with the first side of the second metal layer via a thermally conductive epoxy adhesive
Data Source
AI summary
In some aspects, the techniques described herein relate to a signal distribution assembly configured to conduct signals in a semiconductor device module, the signal distribution assembly including: a metal layer, the metal layer having: a first side, the first side being planar; and a second side opposite the first side, the second side being non-planar and including: a base portion; a first post extending from the base portion; and a second post extending from the base portion. The metal layer can be pre-molded using a molding compound disposed on the second side of the metal later, with respective surfaces of the first post and the second posted exposed through the molding compound, and or the metal layer can be coupled with a thermally conductive insulator (e.g., ceramic) layer.