Premolded Substrate Additive Plating for High Density Interconnects
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Solution Overview
Problem
Conventional semiconductor packaging technologies, such as Flip-Chip QFN, face limitations in conductive trace density due to etching techniques, which restrict the pitch of connections and are mechanically unstable when reducing trace width, while organic substrates are expensive and inferior for extreme applications.
Innovation Solution
Premolded substrates using additive plating techniques allow for higher aspect ratio conductive structures and flexible placement of pads, enabling increased I/O density and reduced pitch without the need for a frame, supporting longer conductive traces and improved mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional etching techniques are used to create conductive traces, then manufacturing simplicity is maintained, but the pitch of connections is restricted and trace width reduction leads to mechanical instability
Solution Approach 1:
The patent replaces conventional mechanical etching techniques with an additive plating process. Instead of removing material to create traces, conductive structures are built up through electroplating, allowing for higher aspect ratios and finer pitch without compromising mechanical stability. This substitution enables the formation of robust, narrow conductive traces that would be impossible to achieve through etching alone.
Solution Approach 2:
The patent changes the fundamental manufacturing parameter from subtractive (etching) to additive (plating). This parameter change allows for precise control of trace width and height, enabling high-density interconnects with improved mechanical properties. The additive process allows traces to be built with controlled thickness and aspect ratio, overcoming the mechanical instability limitation of conventional etching.
2Productivity
If trace width is reduced to increase I/O density, then connection pitch is reduced, but mechanical stability deteriorates
Solution Approach 1:
The additive plating process replaces mechanical etching, enabling the creation of narrow, high-aspect-ratio conductive structures that maintain mechanical integrity. The plating process builds material vertically, creating strong, narrow traces that can support reduced pitch without sacrificing strength.
Solution Approach 2:
The patent employs composite material structures with conductive traces embedded in a molded substrate. This composite approach allows narrow traces to be mechanically supported by the surrounding substrate material, maintaining strength while achieving high I/O density. The integration of conductive material with the substrate creates a mechanically robust composite structure.
3Ease of manufacture
If organic substrates are used for packaging, then manufacturing flexibility is improved, but cost increases and performance in extreme applications deteriorates
Solution Approach 1:
The patent uses composite material structures with conductive traces embedded in a molded substrate. This composite approach allows narrow traces to be mechanically supported by the surrounding substrate material, maintaining strength while achieving high I/O density. The integration of conductive material with the substrate creates a mechanically robust composite structure.
4Strength
If frame structures are used in conventional packaging, then mechanical support is provided, but device complexity and manufacturing steps increase
Solution Approach 1:
The patent merges the functions of the frame structure and the substrate into a single integrated molded component. The conductive traces are embedded directly in the molded substrate, eliminating the need for separate frame structures. This consolidation reduces device complexity while maintaining mechanical support through the composite material structure.
Solution Approach 2:
The molded substrate serves multiple functions simultaneously: it provides mechanical support, houses the conductive traces, and offers structural integrity. This multi-functional design eliminates the need for separate frame components, reducing overall device complexity while maintaining all necessary mechanical functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Premolded substrates achieve higher I/O density with reduced pitch, improved mechanical stability, and enhanced thermal performance, allowing for more efficient power management and thermal conductivity in semiconductor packages.
Implementation Method 1
Premolded substrates using additive plating techniques allow for higher aspect ratio conductive structures
Data Source
AI summary
Various applications of interconnect substrates in power management systems are described.