Preplating Edge Drying Gas Injector for Substrate Processing
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Solution Overview
Problem
In substrate processing systems, the edge of a substrate often experiences non-uniform electrodeposition due to preferential deposition on electrical contacts and potential corrosion from acidic plating solutions, leading to variations in resistance and seal effectiveness issues during transportation between chambers.
Innovation Solution
A substrate processing system with a pre-wetting chamber that applies a pre-wetting liquid and a gas injector to dry the substrate edge at an acute angle, ensuring the edge is dry before electrodeposition, thereby preventing plating solution diffusion and reducing corrosion, while maintaining the interior wet.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the substrate edge is left wet after pre-wetting, then the pre-wetting liquid remains on the surface, but this causes non-uniform electrodeposition and corrosion from acidic plating solutions
Solution Approach 1:
The patent applies different treatments to different regions of the substrate: the edge region is dried while the interior remains wet. This is achieved by positioning gas injectors specifically at the edge region to remove pre-wetting liquid only where needed, preventing both uniform drying and selective wetting, thus achieving local quality differentiation to resolve the contradiction between preventing corrosion and maintaining electrodeposition uniformity
Solution Approach 2:
The patent performs a preliminary drying action at the substrate edge before the electrodeposition process begins. By using gas injectors to remove pre-wetting liquid from the edge region in advance, the system prevents acidic plating solution from causing corrosion during transportation, while the interior remains wet to ensure uniform electrodeposition when the plating solution is applied
2Object-affected harmful factors
If gas is injected to dry the substrate edge, then corrosion is reduced, but the pre-wetting liquid must be removed selectively without affecting the interior
Solution Approach 1:
The gas injectors are positioned to target only the edge region of the substrate, creating a localized drying effect. The injectors are arranged radially outward from the center, with gas flow directed specifically at the periphery where pre-wetting liquid needs removal, while the interior region remains unaffected and maintains its wet state for uniform electrodeposition
Solution Approach 2:
The patent uses angular/azimuthal positioning of gas injectors around the substrate perimeter to achieve radial symmetry in the drying pattern. By arranging multiple gas injectors at different angular positions, the system creates a comprehensive edge-drying effect that circles the substrate, ensuring uniform drying around the entire periphery while maintaining interior wetness
3Adaptability or versatility
If the substrate is transported between chambers, then processing can be performed in multiple chambers, but seal effectiveness deteriorates due to liquid presence
Solution Approach 1:
The patent performs preliminary drying of the substrate edge in the pre-wetting chamber before the substrate is transported to the electrodeposition chamber. This advance action removes the problematic liquid that would compromise seal effectiveness during transportation, ensuring reliable sealing while still allowing multi-chamber processing capability
Solution Approach 2:
The patent segments the substrate surface into two distinct regions with different moisture states: the edge region is dried while the interior remains wet. This segmentation allows the edge to be prepared for sealing and transportation while the interior maintains properties needed for subsequent electrodeposition, thus enabling reliable multi-chamber processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the seal effectiveness, reduces corrosion, and achieves uniform electrodeposition by ensuring the edge is dry before applying the plating solution, improving the overall processing efficiency and reducing variations in resistance.
Implementation Method 1
The at least one gas injector is configured to inject gas toward an edge of the substrate for a drying period subsequent to the pre-wetting period to remove the pre-wetting liquid from the edge of the substrate
Data Source
AI summary
A chamber in a substrate processing system comprises a substrate holder configured to support a substrate, a nozzle arranged above the substrate, the nozzle configured to inject a pre-wetting liquid onto a surface of the substrate during a pre-wetting period, and at least one gas injector arranged radially outward of the nozzle. The at least one gas injector is configured to inject gas toward an edge of the substrate for a drying period subsequent to the pre-wetting period to remove the pre-wetting liquid from the edge of the substrate.