Prepreg Frame Encapsulation for Power Electronics Pressure Sintering
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Solution Overview
Problem
Existing methods for insulating encapsulation in power electronics, such as underfill processes in pressure sintering, are complex, costly, and do not completely seal interstices and gaps.
Innovation Solution
A semifinished product in the form of a prepreg or dielectric resin, reinforced with fibers, is used to create an insulating encapsulation by surrounding the connecting material during the populating process, allowing for simultaneous electrical connection and insulation through compatible processing parameters.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If underfill process is used to seal interstices and gaps in pressure sintering, then insulation reliability is improved, but device complexity and production cost increase
Solution Approach 1:
The patent combines the insulation function and sealing function into a single integrated semifinished product that performs both underfill and encapsulation simultaneously, eliminating the need for separate underfill and encapsulation process steps
Solution Approach 2:
The semifinished product serves multiple functions: it provides electrical insulation, seals interstices and gaps, and acts as an encapsulation material, thereby reducing the number of separate components and process steps required
2Reliability
If underfill process is used to seal interstices and gaps, then insulation reliability is improved, but production time increases
Solution Approach 1:
The patent merges the underfill process and encapsulation process into a single simultaneous operation using one semifinished product, thereby reducing the total production time while maintaining insulation reliability
Solution Approach 2:
The semifinished product is pre-configured with the exact shape and size needed to simultaneously perform underfill and encapsulation functions, eliminating the need for sequential application and reducing production time
3Reliability
If underfill process is used to seal interstices and gaps, then insulation reliability is improved, but production cost increases
Solution Approach 1:
The semifinished product performs multiple functions (insulation, sealing, encapsulation) in a single component, reducing the total material cost and process cost compared to using separate underfill and encapsulation materials and processes
Solution Approach 2:
The patent combines multiple manufacturing steps into one simultaneous process, reducing labor costs, equipment requirements, and overall production complexity, thereby lowering production cost while maintaining insulation reliability
4Reliability
If underfill process is used to seal interstices and gaps, then insulation reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The semifinished product is pre-formed with precise dimensions and geometry that automatically ensure proper sealing of interstices and gaps, eliminating the need for complex real-time precision control during the application process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the production process, reduces costs, and effectively seals interstices and gaps, making it suitable for mass production while maintaining high insulation and electrical connection integrity.
Implementation Method 1
pressure sintering technology and/or soldering technology, multistage methods are employed, in which, in a technologically complex sequential process, a bond is first established by pressure sintering
Implementation Method 2
compression of the insulation material in the form of the semifinished product
Implementation Method 3
a highly effective electrically insulating encapsulation of the interstices between substrate surfaces and exposed semiconductor components
Implementation Method 4
Some embodiments are essentially a dielectric resin
Data Source
AI summary
Various embodiments of the teachings herein include a semifinished product for use in the populating of a power electronics component by a connecting method. The product includes an electrically insulating prepreg frame electrically insulated. The prepreg frame is configured for surrounding an applied connecting material at a metallized installation site during the population. A material of the prepreg frame enables simultaneous processability of electrical connection and electrical insulation by compression of the insulation material in the form of the semifinished product since the processing parameters of the electrical connecting material and the semifinished product are compatible.