Prepreg Molding for Fine-Line Semiconductor Package Substrates
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Solution Overview
Problem
Wiring boards for semiconductor packages face challenges in forming fine wiring lines with minimal variations in width, which affects the density and reliability of semiconductor chip connections.
Innovation Solution
A method involving a molding treatment that increases the temperature of a laminated body with a prepreg, comprising an inorganic fiber base material and a thermosetting resin composition, under specific heating conditions to achieve a melt viscosity increase rate of 55×10^3 Pa·s/min or greater, resulting in a substrate material with reduced thickness variations and stable fine wiring line formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If fine wiring lines are formed to increase density, then connection density is improved, but line width variations increase
Solution Approach 1:
The patent applies parameter changes by controlling the heating rate during molding to achieve a specific melt viscosity increase rate (55×10³ Pa·s/min or greater). This parameter control ensures uniform resin flow and curing, which suppresses line width variations in fine wiring lines while maintaining high connection density.
Solution Approach 2:
The patent utilizes the phase transition of the thermosetting resin from liquid to solid during curing. By controlling the heating rate to achieve a specific melt viscosity increase rate, the resin flows uniformly before curing and then solidifies uniformly, preventing variations in fine wiring line width while enabling high-density connections.
2Manufacturing precision
If heating rate is increased to control melt viscosity, then manufacturing precision is improved, but energy consumption increases
Solution Approach 1:
The patent optimizes the heating rate parameter to achieve the desired melt viscosity increase rate (55×10³ Pa·s/min or greater) with minimal energy input. This controlled parameter change ensures uniform thickness in the substrate while avoiding excessive energy consumption that would result from higher heating rates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the stable formation of fine wiring lines with reduced line width variations, enhancing the density and reliability of semiconductor chip connections while minimizing warpage and improving productivity.
Implementation Method 1
heating and pressurizing a laminated body including several laminated sheets of a prepreg
Implementation Method 2
a melt viscosity of the prepreg increases to 1000×10³ Pa·s at a rate of 55×10³ Pa·s/min or greater from a time point at which a minimum melt viscosity is exhibited
Data Source
AI summary
A method for manufacturing a substrate material for a semiconductor package having an insulating substrate includes forming an insulating substrate from a prepreg by a molding treatment including increasing a temperature of a laminated body including two or more laminated sheets of a prepreg while pressurizing the laminated body. The molding treatment includes increasing the temperature of the laminated body under a heating condition in which a melt viscosity of the prepreg increases to 1000×103 Pa·s at a rate of 55×103 Pa·s/min or greater from a time point at which a minimum melt viscosity is exhibited.