Prepreg Resin Composition Balancing Dielectric Loss and Foil Adhesion

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Solution Overview

Problem

Existing substrate materials for wiring boards lack sufficient low dielectric properties, heat resistance, adhesive properties to metal foils, and desmear properties, which are essential for high-frequency applications and environmental stability.

Innovation Solution

A resin composition containing a preliminary reaction product of a polyphenylene ether compound, an acid anhydride, and a benzoxazine compound, which, when cured, provides excellent low dielectric properties, heat resistance, adhesive properties to metal foils, and desmear properties, with a high glass transition temperature.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If polyphenylene ether is used as substrate material for wiring boards, then low dielectric properties are improved, but adhesive properties to metal foils and heat resistance are insufficient

Engineering Contradiction:

Improvelow dielectric propertiesVSAvoidadhesive properties to metal foils

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent uses a composite resin composition combining polyphenylene ether with specific additives including a silane-modified polyphenylene ether compound, a silane coupling agent, and a flame retardant. This composite formulation maintains the low dielectric properties of polyphenylene ether while adding improved adhesive properties through the silane-modified components and enhanced heat resistance through the flame retardant system.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent modifies the chemical parameters of polyphenylene ether by introducing silane modification and reacting with specific compounds containing unsaturated double bonds. These parameter changes in molecular structure enable the resin to achieve both low dielectric properties and improved adhesive properties to metal foils simultaneously.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If polyphenylene ether is used as substrate material for wiring boards, then low dielectric properties are improved, but heat resistance is insufficient

Engineering Contradiction:

Improvelow dielectric propertiesVSAvoidheat resistance

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent incorporates a flame retardant component in the resin composition that provides enhanced heat resistance while maintaining the low dielectric properties of polyphenylene ether. The composite formulation includes specific flame retardant compounds that improve thermal stability without compromising the dielectric performance.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent changes the thermal parameters of polyphenylene ether by introducing flame retardant additives and modifying the polymer structure through silane modification. These parameter changes increase the heat resistance and glass transition temperature while preserving the low dielectric properties.

Inventive Principle:

Principle #35Parameter changes

3Ease of manufacture

If conventional resin compositions are used, then ease of manufacture is maintained, but desmear properties and adhesive properties are insufficient

Engineering Contradiction:

Improveease of manufactureVSAvoiddesmear properties

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent modifies the chemical composition parameters of conventional resin systems by introducing specific silane-modified polyphenylene ether compounds and flame retardants. These parameter changes improve desmear properties and adhesive properties while maintaining ease of manufacture through standard curing processes.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The resin composition achieves improved performance in wiring boards by maintaining low dielectric properties, enhancing adhesive strength to metal foils, and ensuring effective desmear capabilities while providing heat resistance and stability across a wide temperature range.

Implementation Method 1

a preliminary reaction product (A) obtained by previously reacting a mixture containing a polyphenylene ether compound (a1) having a hydroxyl group in the molecule and an acid anhydride (a2) having an acid anhydride group in the molecule

Methodology Applied

Scientific EffectChemical Bonding: Chemical Bonding

Implementation Method 2

the resin composition affords a cured product, which is excellent in low dielectric properties, heat resistance, adhesive properties to a metal foil, and desmear properties and has a high glass transition temperature

Methodology Applied

Scientific EffectCuring reaction: Chemical Bonding

Data Source

PatentUS20250382455A1Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board

Publication Date: 2025.12.18 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

AI summary

A resin composition that contains a preliminary reaction product (A) obtained by previously reacting a polyphenylene ether compound (a1) having a hydroxyl group in the molecule and an acid anhydride (a2) having an acid anhydride group in the molecule, a benzoxazine compound (B) having an alkenyl group in the molecule, and a reactive compound (C) having an unsaturated double bond in the molecule.