Prepreg for High-Frequency Wiring Boards
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Solution Overview
Problem
Current substrate materials for high-frequency electronic devices, such as millimeter wave radar substrates, face challenges in achieving both low dielectric properties and high heat resistance, which are essential for reducing signal loss and increasing transmission speed.
Innovation Solution
A prepreg comprising a resin composition with a modified polyphenylene ether compound and a crosslinkable curing agent, combined with quartz glass cloth and a silane coupling agent, is developed to achieve low dielectric loss tangent and high heat resistance, optimizing the dielectric properties and heat resistance of the cured product.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If polyphenylene ether is modified to improve heat resistance, then heat resistance is improved, but dielectric properties may deteriorate
Solution Approach 1:
The patent applies parameter changes by precisely controlling the molecular weight of polyphenylene ether (number average molecular weight 1000-7000) and the structure of terminal modifying groups to achieve both heat resistance and low dielectric loss. The terminal modifying group content is controlled at 0.1-10 mmol/g, and the curing agent content is optimized at 1-20 parts by mass per 100 parts by mass of polyphenylene ether, creating a balanced composition that satisfies both contradictory requirements.
Solution Approach 2:
The patent creates a composite material system combining polyphenylene ether with terminal modifying groups and crosslinkable curing agents. This composite structure allows the base polyphenylene ether to provide low dielectric properties while the terminal modifying groups and curing agents contribute to heat resistance through crosslinking, resolving the contradiction between heat resistance and dielectric loss.
2Productivity
If higher wiring density and multilayering are implemented, then integration is improved, but signal loss increases
Solution Approach 1:
The patent changes the dielectric parameters of the substrate material by using polyphenylene ether with specific molecular weight (1000-7000) and controlling terminal modifying group content (0.1-10 mmol/g). These parameter changes result in reduced permittivity and dielectric loss tangent, allowing higher wiring density and multilayering to be implemented without increasing signal transmission loss.
3Temperature
If crosslinkable curing agent is added to improve heat resistance, then heat resistance is improved, but dielectric loss tangent increases
Solution Approach 1:
The patent applies parameter changes by optimizing the type and content of crosslinkable curing agents. The curing agent content is controlled at 1-20 parts by mass per 100 parts by mass of polyphenylene ether, and the molecular structure of curing agents is selected to ensure crosslinking density that provides heat resistance while maintaining low dielectric loss tangent of 0.002 or less at 10 GHz.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The prepreg exhibits excellent low dielectric properties and heat resistance, enabling the production of metal-clad laminates and wiring boards with improved signal transmission speed and reliability.
Implementation Method 1
the prepreg contains a silane coupling agent having an unsaturated carbon-carbon double bond in a molecule
Implementation Method 2
the resin composition contains a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond, and a crosslinkable curing agent having an unsaturated carbon-carbon double bond in a molecule
Data Source
AI summary
One aspect of the present invention is a prepreg including a resin composition or a semi-cured product of the resin composition and a fibrous base material, in which the resin composition contains a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond, and a crosslinkable curing agent having an unsaturated carbon-carbon double bond in a molecule, the fibrous base material is quartz glass cloth, the prepreg contains a silane coupling agent having an unsaturated carbon-carbon double bond in a molecule, in an amount of 0.01% by mass or more and less than 3% by mass with respect to the prepreg, and a cured product of the prepreg has a dielectric loss tangent of 0.002 or less at 10 GHz.