Pre-singulated Leadframe for Semiconductor Package Assembly
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Solution Overview
Problem
The integration of discrete passive devices within semiconductor packages increases their size and cost, requiring more mold compound and routing connections, which complicates the assembly process and reduces efficiency.
Innovation Solution
A leadframe with pre-singulated leads or lead terminals, including metal bars and optional passive devices, is used, which are arranged on a substrate to match the bond pads of semiconductor dies, allowing direct bonding and eliminating the need for sawing, thus reducing package size and assembly complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If discrete passive devices are added inside semiconductor packages, then functionality is improved, but package size increases
Solution Approach 1:
The patent merges passive devices with the leadframe structure by forming lead terminals that directly incorporate passive device functionality. The lead terminals are formed as continuous structures that provide both mechanical support and passive device functions (capacitance, inductance, or resistance) through their geometry and material properties, eliminating the need for separate discrete passive components.
Solution Approach 2:
The lead terminals serve multiple functions simultaneously: they provide mechanical support for the semiconductor die, establish electrical connections, and provide passive device functionality through their structural design. This multi-functionality reduces the overall component count and package size while maintaining required functionality.
2Adaptability or versatility
If discrete passive devices are added inside semiconductor packages, then functionality is improved, but manufacturing cost increases
Solution Approach 1:
The patent combines the leadframe structure with passive device functionality into a single integrated component. This merging eliminates the need for separate manufacturing processes for discrete passive devices, reduces assembly steps, and lowers overall manufacturing cost while maintaining required functionality.
Solution Approach 2:
The lead terminals are designed to perform multiple functions (mechanical support, electrical connection, and passive device function) simultaneously, reducing the total component count and simplifying the manufacturing process. This multi-functionality leads to cost reduction by eliminating separate parts and assembly operations.
3Adaptability or versatility
If discrete passive devices are added inside semiconductor packages, then functionality is improved, but assembly complexity increases
Solution Approach 1:
The patent merges passive device functionality directly into the leadframe structure, creating an integrated assembly that requires fewer separate components. This reduces assembly complexity by eliminating the need to handle and position discrete passive devices separately from the leadframe.
Solution Approach 2:
The lead terminals are designed as multi-functional elements that simultaneously provide mechanical support, electrical connection, and passive device function. This integration reduces the number of assembly steps and simplifies the overall assembly process while maintaining required functionality.
4Ease of manufacture
If conventional leadframes with saw streets are used, then singulation is achieved, but saw blade wear increases
Solution Approach 1:
The patent pre-singulates the lead terminals during leadframe fabrication, creating individually separated lead terminals before packaging. This segmentation eliminates the need for sawing operations during package assembly, reducing saw blade wear and associated costs while maintaining singulation functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a smaller, more cost-effective package with reduced routing and material usage, enabling faster assembly and extended saw blade life, while allowing for direct die attachment and integration of additional passive components.
Implementation Method 1
which upon a heating such as a bake or reflow form the bonded connections for the semiconductor package
Data Source
AI summary
A packaged semiconductor device includes at least one semiconductor die having circuitry with circuit nodes coupled to bond pads that have bonding features thereon. A plurality of leads or lead terminals include at least metal bars, wherein the plurality of leads or lead terminals are exclusive of any saw marks. The semiconductor die is flipchip attached with a bonded connection between respective bonding features and respective leads or lead terminals.