Press Contact Electronics Module for Transmission Control
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Solution Overview
Problem
Existing electronic modules used in motor vehicle transmission control units face challenges due to mechanical and chemical stresses, and the complexity of soldering or welding processes, which can lead to reliability issues and increased costs.
Innovation Solution
The use of press contacts and press-in technology for electrical connections on a printed circuit board, combined with a carrier plate and a hardened liquid-processable layer to secure and protect electronic components, eliminating the need for soldering or welding and enhancing mechanical and chemical protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering or welding is used to connect electronic components to conductor tracks, then electrical connections are established, but the process becomes complex and reliability decreases due to solder joint disruptions and thermal stresses
Solution Approach 1:
The patent replaces the thermal-based soldering or welding process with a mechanical press-in system. Press contacts are mechanically inserted into recesses in the printed circuit board and secured with adhesive, eliminating the need for heat-based joining. This substitution removes thermal stresses that cause solder joint disruptions and simplifies the manufacturing process by avoiding complex soldering equipment and procedures.
Solution Approach 2:
The patent changes the connection method from thermal bonding (soldering/welding) to mechanical bonding (press-in with adhesive). This parameter change involves transitioning from high-temperature processes to room-temperature mechanical assembly, thereby eliminating thermal expansion mismatches and thermal stress-related failures while maintaining electrical connectivity.
2Reliability
If lead-free solders are used to meet newer standards, then environmental requirements are satisfied, but the solder becomes very hard and inelastic, increasing the probability of connection failure
Solution Approach 1:
The patent replaces the solder joint system entirely with a mechanical press-in contact system secured by adhesive. This eliminates the need for lead-free solder and its associated brittleness issues. The press contacts provide mechanical flexibility and can accommodate thermal expansion differences without the inelastic constraints of lead-free solder joints.
Solution Approach 2:
The patent uses a composite connection system combining press-in metal contacts with adhesive bonding. This composite approach provides both mechanical strength from the metal contact and flexible bonding from the adhesive, overcoming the brittleness of lead-free solder while maintaining reliable electrical and mechanical connections.
3Reliability
If electronic components are mounted on a printed circuit board with conductor tracks, then electrical interconnection is achieved, but the components are vulnerable to mechanical and chemical damage from transmission fluid and vibrations
Solution Approach 1:
The patent segments the electronic module into distinct functional areas: the printed circuit board for electrical interconnection, press contacts for electrical connection, and adhesive for mechanical securing and environmental protection. This segmentation allows each component to perform its specific function optimally while the adhesive provides comprehensive protection against transmission fluid and vibrations without complicating manufacturing.
Solution Approach 2:
The patent introduces adhesive as an intermediary substance that serves multiple functions: it mechanically secures the press contacts to the printed circuit board, provides chemical protection against transmission fluid, and dampens vibrations. This intermediary element protects components without adding manufacturing complexity, as the adhesive application is a simple coating process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the manufacturing process, reduces costs, and enhances the reliability and temperature resistance of electronic modules by avoiding solder joint disruptions and thermal stresses, while providing robust mechanical and chemical protection.
Implementation Method 1
Areas of conductor tracks on the printed circuit board adjacent to one of the press contacts are covered by a hardened liquid-processable layer
Implementation Method 2
enhancing the reliability and temperature resistance of electronic modules by avoiding solder joint disruptions and thermal stresses, while providing robust mechanical and chemical protection
Implementation Method 3
The electronic component is electrically connected to conductor tracks of the printed circuit board via press contacts
Implementation Method 4
the socket is clamped between the carrier plate and the printed circuit board in such a way that the electronic component is positively locked in a direction transverse to the carrier plate
Data Source
Figure 1~2
Figure 3~4
Figure 5
AI summary
The invention relates to an electronics module (1) which can be used in particular for a transmission control unit for a motor vehicle. The electronics module (1) comprises a carrier plate (5), a circuit board (3) having conducting paths arranged thereon, and at least one electronic component (7, 11). The electronics module (1) is characterised in that at least sub-regions (9, 13) of the electronic component (7, 11) are accommodated between the carrier plate (5) and the circuit board (3), in such a way that the electronic component (7, 11) is secured by a form-fit in a transverse direction in relation to the carrier plate (5). The electronic component (7, 11) is thus electrically connected via press contacts (23) to conducting paths of the circuit board (3), and regions of conducting paths of the circuit board (3) adjacent to one of the press contacts (23) are covered by a hardened layer (33) that can be processed as a fluid, such as, for example, an adhesive or lacquer. The proposed concept permits an electronics module to be produced without soldering or welding processes, via which both production costs and production complexity can be reduced, and a reliability of the electronics module can be improved.