Dissimilar Metal Press-Fit Bonding With Deformation Suppression
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Solution Overview
Problem
Conventional methods for bonding metallic members with different physical properties, such as carbon steel and aluminum alloys, often require significant upset to ensure bonding strength, leading to increased scale and weight due to deformation and burr formation.
Innovation Solution
A metallic member bonding device with a pressurizing unit, current supply unit, and deformation suppressing unit that applies a welding current and suppresses deformation of the member with lower proof stress or melting temperature, preventing burr generation and reducing the amount of upset during bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a large amount of upset is applied to ensure bonding strength when bonding different metals with different physical properties, then bonding strength is improved, but the scale and weight of the bonding part increase
Solution Approach 1:
The deformation suppressing unit applies a preliminary counteracting force to prevent the low-proof-stress material from deforming outward during the upset process. By opposing the deformation tendency before it fully occurs, the unit prevents burr formation and material discharge, thereby maintaining bonding strength without increasing the amount of upset required.
Solution Approach 2:
The invention introduces a new parameter (deformation suppressing force) that changes the stress state of the materials during bonding. By applying this additional parameter through the deformation suppressing unit, the system can achieve adequate bonding strength with reduced upset, preventing the material with lower proof stress from yielding and forming burrs.
2Strength
If a large amount of upset is applied to ensure bonding strength when bonding different metals with different physical properties, then bonding strength is improved, but the scale of the bonding part increases
Solution Approach 1:
The deformation suppressing unit applies a preliminary counteracting force to prevent the low-proof-stress material from deforming outward during the upset process. By opposing the deformation tendency before it fully occurs, the unit prevents burr formation and material discharge, thereby maintaining bonding strength without increasing the amount of upset required.
Solution Approach 2:
The invention introduces a new parameter (deformation suppressing force) that changes the stress state of the materials during bonding. By applying this additional parameter through the deformation suppressing unit, the system can achieve adequate bonding strength with reduced upset, preventing the material with lower proof stress from yielding and forming burrs.
3Strength
If conventional bonding method is used for metals with different proof stress, then bonding can be achieved, but deformation occurs in the material with lower proof stress
Solution Approach 1:
The deformation suppressing unit applies a preliminary counteracting force to prevent the low-proof-stress material from deforming outward during the upset process. By opposing the deformation tendency before it fully occurs, the unit prevents burr formation and material discharge, thereby maintaining bonding strength without increasing the amount of upset required.
Solution Approach 2:
The invention introduces a new parameter (deformation suppressing force) that changes the stress state of the materials during bonding. By applying this additional parameter through the deformation suppressing unit, the system can achieve adequate bonding strength with reduced upset, preventing the material with lower proof stress from yielding and forming burrs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves high bonding strength while minimizing the increase in bonding part size and weight by effectively suppressing deformation and burr formation, ensuring a long bonding length with reduced upset.
Implementation Method 1
a large current is passed through the members in a short period of time... an outer circumferential surface of the first metallic member and one side interface portion of the second metallic member are softened and plastically fluidized
Data Source
AI summary
A metallic member bonding device includes a pressurizing unit, a current supply unit, and a deformation suppressing unit. The pressurizing unit pressurizes a first metallic member toward a hole portion of a second metallic member to press the first metallic member therein. The current supply unit supplies a welding current between the first metallic member and the second metallic member. The deformation suppressing unit suppresses deformation of one of the first metallic member and the second metallic member, the one member having a constituent metallic material with at least one of a proof stress and a melting temperature lower than that of the other member, the deformation being in a direction of a cross section crossing a direction of the press-in. Then, the deformation suppressing unit is provided in a region covering at least a plastic flow range in the press-in direction.