Press-Fit Connector Assembly for Stable Power Module Interconnection
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Solution Overview
Problem
Current semiconductor power modules are costly to produce while maintaining performance characteristics, and there is a need for improved electrical interconnections that can withstand high current, voltage, and heat.
Innovation Solution
The semiconductor device assembly incorporates an electrically conductive press-fit connector with a flange and base portion, where the base portion is secured within a receptacle, maintaining vertical separation between the flange and the receptacle's upper end, providing a stable and friction-fit connection, which enhances assembly stability and prevents misalignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electrical interconnection methods are used in semiconductor power modules, then reliable electrical connections can be achieved, but manufacturing costs increase
Solution Approach 1:
The electrical interconnection system is divided into separate components: a receptacle attached to the electronics carrier and a press-fit connector that inserts into the receptacle. This segmentation allows for simplified manufacturing of individual components while maintaining reliable electrical connections, reducing overall manufacturing cost compared to conventional integrated solutions
Solution Approach 2:
The press-fit connector's base portion is inserted into and nested within the receptacle, creating a compact integrated structure. The connector maintains vertical separation from the receptacle's upper end while being mechanically retained within it, providing reliable electrical connection without complex assembly procedures
2Ease of operation
If press-fit connector is inserted into receptacle without vertical separation maintenance, then assembly simplicity increases, but alignment precision and mechanical stability deteriorate
Solution Approach 1:
The base portion of the press-fit connector is designed with a configuration that automatically maintains vertical separation from the receptacle's upper end upon insertion. This preliminary structural arrangement ensures precise alignment and mechanical stability are built into the component design itself, eliminating the need for complex alignment procedures during assembly while maintaining high manufacturing precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces manufacturing costs and improves the reliability of semiconductor power modules by maintaining precise alignment and mechanical stability during assembly, while preventing over-insertion and ensuring reliable electrical connections.
Implementation Method 1
the base portion of the press-fit connector is configured to maintain vertical separation between the flange and an upper end of the receptacle in the secured position
Data Source
Figure 1A~1B
Figure 2A~2C
Figure 3A~3E
AI summary
A semiconductor device includes an electronics carrier, an electrically conductive receptacle attached to a first pad of the electronics carrier, and an electrically conductive press-fit connector including a flange and a base portion extending from the flange to a first end of the press-fit connector, wherein the press-fit connector is in a secured position whereby the base portion is disposed within and securely retained by the receptacle, and wherein the base portion of the press-fit connector is configured to maintain vertical separation between the flange and an upper end of the receptacle in the secured position.