Press-fit Connector Shielding for 10 Gbps Signal Integrity
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Solution Overview
Problem
Existing connectors face challenges in achieving high port density while maintaining performance for 10 Gbps data rates, especially in stacked configurations, due to issues with signal loss, resonance, and cross-talk, which complicates manufacturing and design.
Innovation Solution
A press-fit connector design with angled rows and shield plates on both sides of wafer sets, providing a 0.5 mm pitch interface, supports 10 Gbps data rates by using common bars for balanced electrical connections and improved shielding, allowing back routing and reducing capacitive coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If stacked connectors are used to increase port density, then the number of ports per unit area increases, but signal loss and cross-talk increase due to additional signal pairs and resonance in upper ports
Solution Approach 1:
The patent applies local quality by providing shielding structures specifically between adjacent signal pairs in stacked connectors. The shielding members are positioned locally at critical interfaces where cross-talk and signal loss occur, rather than uniformly throughout the entire connector. This targeted approach reduces signal degradation at problem areas while maintaining port density.
Solution Approach 2:
The patent introduces shielding members as intermediary elements between adjacent signal pairs in stacked connectors. These shielding members act as mediators that electrically isolate adjacent signal paths, reducing capacitive coupling and cross-talk. The shielding structures include ground references that intermediate between differential pairs, preventing direct electromagnetic coupling while allowing the compact stacked configuration to maintain high port density.
2Ease of manufacture
If press-fit configuration is used for stacked connectors, then manufacturing is simplified, but performance at higher data rates deteriorates due to connector-to-circuit board interface issues
Solution Approach 1:
The patent applies parameter changes by optimizing the electrical parameters of the press-fit interface through carefully designed shielding structures. The shielding members are positioned and dimensioned to control impedance, reduce reflections, and minimize signal loss at the connector-to-circuit board interface. This allows press-fit construction to maintain high data rate performance by electrically optimizing the interface parameters despite the mechanical simplicity of press-fit mounting.
3Quantity of substance
If SMT configuration is used for QSFP connectors, then four transmits and four receive sub-channels are provided in compact space, but port density is limited and belly-to-belly configuration requires mounting on both sides of circuit board
Solution Approach 1:
The patent applies dimensionality change by transitioning from horizontal SMT mounting to vertical stacked configuration. Instead of placing connectors side-by-side on the circuit board surface (two-dimensional arrangement), the invention stacks connectors vertically along the Z-axis (three-dimensional arrangement). This vertical stacking enables higher port density within the same footprint while maintaining SMT compatibility, as the stacked connectors can still be mounted using standard SMT processes but utilize the vertical dimension for additional ports.
Data Source
AI summary
A connector system is disclosed that is configured to provide terminals that support data rates of 10 Gbps or more. Such a connector system includes a wafer set configured to enable broad-side coupling of a differential pair of terminals across an air channel formed between the terminals.