Press Fit Semiconductor Light Source Alignment
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Solution Overview
Problem
Existing illumination devices face challenges in precisely positioning and aligning semiconductor light sources on carriers due to dimensional tolerances and thermal expansion, leading to play and reduced thermal coupling.
Innovation Solution
The use of a press fit mechanism with rod-type fastening elements and corresponding holes at multiple locations ensures precise alignment and thermal coupling, with clamp-type holding devices compensating for thermal expansion and mechanical stresses, and allowing for a common press fit with optical devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive material is used to fix the semiconductor light source arrangement to the carrier, then the fixing process is simple, but the positioning precision and alignment are insufficient due to dimensional tolerances
Solution Approach 1:
The fixing system is segmented into multiple independent press fit locations (at least three) distributed across the carrier surface. Each press fit location acts as an independent fixing point, collectively providing both precise positioning and alignment while maintaining manufacturing simplicity through modular assembly
Solution Approach 2:
Press fit fastening elements serve as intermediary components between the semiconductor light source arrangement and the carrier. These elements mediate the connection by providing mechanical interference fit that compensates for dimensional tolerances, achieving both precise positioning and secure fixation
2Ease of manufacture
If conventional fixing methods are used, then assembly is straightforward, but thermal coupling between the semiconductor light source arrangement and carrier is insufficient
Solution Approach 1:
The press fit fastening elements are designed with predetermined dimensional tolerances and interference fit characteristics that pre-establish optimal thermal contact pressure. This preliminary design ensures that when assembled, the mechanical press fit automatically creates sufficient thermal coupling without requiring additional thermal management steps
Solution Approach 2:
The fixing system utilizes controlled parameter changes in the mechanical press fit force to simultaneously achieve precise positioning and enhanced thermal coupling. By adjusting the interference fit dimensions, the system optimizes both mechanical fixation strength and thermal contact conductance
3Manufacturing precision
If multiple press fit locations are used to ensure precise alignment, then positioning accuracy improves, but the complexity of the fixing mechanism increases
Solution Approach 1:
The press fit fastening elements are designed as universal components that perform multiple functions simultaneously: mechanical fixation, precise positioning, alignment, and thermal coupling. This multi-functionality eliminates the need for separate components for each function, maintaining simplicity despite using multiple press fit locations
4Device complexity
If adhesive material is used for fixation, then the structure remains simple, but play-free fastening and thermal coupling are not achieved
Solution Approach 1:
The adhesive bonding system is replaced with a mechanical press fit system that uses interference fit and elastic deformation principles. This mechanical substitution eliminates the compliance and play associated with adhesives, providing rigid play-free fastening while maintaining relatively simple structure through straightforward press fit geometry
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a play-free, precisely aligned semiconductor light source and optical device arrangement with enhanced thermal coupling, maintaining system efficiency and accuracy despite thermal changes, and allowing for direct heat dissipation.
Implementation Method 1
the mechanical stress of the press fit, and it is possible to ensure that the at least one semiconductor light source arrangement is fastened to the carrier in a play-free manner
Implementation Method 2
the effects of different thermal expansion coefficients of the at least one semiconductor light source arrangement and the carrier are compensated for in relation to the relative position and alignment
Implementation Method 3
the press fit renders possible a good thermal coupling between the at least one semiconductor light source arrangement and its carrier
Data Source
AI summary
Various embodiments may relate to an illumination device including at least one semiconductor light source arrangement that is fixed to a carrier. The at least one semiconductor light source arrangement is fixed to the carrier at multiple locations by means of a press fit.