Press Fit Passive Components in PCB Vias
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Solution Overview
Problem
Conventional surface mount and buried passive components occupy excessive space on printed circuit boards, particularly in densely populated areas like ball grid arrays, and introduce undesirable inductance due to extra stub lengths created by vias, making it challenging to optimize component placement and electrical performance.
Innovation Solution
The introduction of press fit passive components, which are designed to fit partially or entirely within vias on printed circuit boards, utilizing a cylindrical body with a non-conductive dielectric collar to secure the component and minimize space usage, eliminating the need for additional vias and traces, and featuring solderable terminals for connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If conventional surface mount passive components are used, then component functionality is maintained, but board surface area increases significantly
Solution Approach 1:
The passive component is nested within the via structure of the circuit board, utilizing the existing via space to house the component body. The via acts as a container for the component, eliminating the need for separate component mounting areas on the board surface.
Solution Approach 2:
The component placement transitions from the two-dimensional board surface to the three-dimensional via interior space. By moving the component into the via, the solution utilizes the vertical dimension and internal volume of the via rather than consuming horizontal board area.
2Reliability
If conventional surface mount components are placed with vias, then electrical connection is established, but unwanted inductance is introduced due to extra stub lengths
Solution Approach 1:
The component is merged with the via structure itself, with the component body occupying the via interior space. This integration eliminates the separation between the via and component that creates stub lengths, thereby removing the source of unwanted inductance.
Solution Approach 2:
The harmful stub length is extracted and eliminated by placing the component directly within the via. The via interior space that would otherwise create a stub is now occupied by the component body, removing the problematic extension.
3Ease of manufacture
If more vias are used to connect components to signal traces, then electrical connection is achieved, but device complexity increases
Solution Approach 1:
The via structure serves multiple functions: it provides the mechanical anchor for the component, the electrical connection path through the board, and the housing for the component body. This multi-functionality eliminates the need for separate connection vias and reduces overall device complexity.
Data Source
AI summary
A press fit passive component, such as a resistor or capacitor, adapted to fit within, or partially within, a via of a printed circuit board. In one example, the press fit passive component has a cylindrically shaped body with solderable terminals at either end of the body, and a dielectric collar disposed at least partially about the cylindrically shaped body. The component is placed in the via and soldered in order to provide a mechanical and electrical connection to the printed circuit board.