Press-Fit Power Module Contacts for Low-Cost Reliable Retention

The patent replaces expensive conventional substrates (DBC, IMS, AMB) with a simpler, lower-cost substrate structure that achieves sufficient performance for the application. The simplified substrate design uses basic metal regions and insulating materials instead of complex multi-layer power electronic substrates, reducing manufacturing cost while maintaining adequate electrical and mechanical performance.

The patent extracts and eliminates unnecessary components from conventional IPM structures. By removing the complex multi-layer power electronic substrate and traditional plastic housing, the design retains only the essential functional elements needed for semiconductor device operation, thereby reducing cost while preserving core performance characteristics.

The patent incorporates retention features directly into the substrate structure before connector installation. The substrate includes pre-formed recesses, protrusions, or integrated retention mechanisms that automatically secure press-fit connectors upon insertion, eliminating the need for separate retention components and ensuring reliable mechanical bonding through design-inherent retention action.

The patent merges the retention function with the substrate structure itself. Instead of using separate retention mechanisms, the substrate is designed with integrated features (such as recesses or interlocking geometries) that simultaneously provide structural support and secure retention of press-fit connectors, reducing component count while ensuring reliable connection.