Press-fit Semiconductor Package with Integrated Through-Hole
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Solution Overview
Problem
Press-fit technology is challenging to adapt to small applications like remote motion sensing or pressure sensing in vehicles due to the size and cost disadvantages of printed circuit board (PCB) platforms, and there is a need to reduce the footprint and cost of semiconductor devices.
Innovation Solution
Integration of a pre-fabricated through-hole in a semiconductor package using a standard semiconductor package molding process, allowing direct press-fit connection with a male pin without a PCB, utilizing a lead frame and plastic epoxy mold compound to create holes for press-fit connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If press-fit technology is used with PCB platform, then reliable electrical and mechanical connection is achieved, but device footprint and cost increase
Solution Approach 1:
The patent merges the press-fit connection functionality directly into the semiconductor package by integrating a press-fit pin into the package substrate, eliminating the need for a separate PCB platform. This consolidation achieves reliable electrical and mechanical connection while significantly reducing device footprint.
Solution Approach 2:
The semiconductor package is designed to serve multiple functions: it houses the semiconductor device, provides electrical connections through integrated leads, and incorporates a press-fit pin for mechanical and electrical connection to the mating device. This multi-functionality eliminates the need for a dedicated PCB platform.
2Reliability
If PCB platform is used for press-fit connection, then reliable interconnection is achieved, but manufacturing cost increases
Solution Approach 1:
The patent combines the interconnection function with the semiconductor package manufacturing process by integrating the press-fit pin during package assembly. This eliminates the need for separate PCB manufacturing and assembly steps, reducing overall manufacturing cost while maintaining reliable interconnection.
Solution Approach 2:
The semiconductor package is designed to be self-sufficient by incorporating all necessary connection elements (leads and press-fit pin) within the package structure itself. The package provides its own interconnection capability without requiring an external PCB platform, thereby reducing manufacturing complexity and cost.
3Ease of manufacture
If standard semiconductor package molding process is used, then manufacturing simplicity is maintained, but integration of press-fit hole becomes challenging
Solution Approach 1:
The press-fit hole is pre-formed in the package substrate before the semiconductor device is mounted and before final encapsulation. This preliminary action allows the hole to be integrated into the package structure using standard molding processes without requiring additional complex steps later in the manufacturing sequence.
Solution Approach 2:
The patent modifies the molding process parameters to accommodate the press-fit hole formation. By adjusting parameters such as mold cavity design, injection pressure, and material flow characteristics, the press-fit hole is successfully integrated into the package during standard molding without requiring fundamentally new manufacturing processes.
Data Source
AI summary
A press-fit semiconductor device includes a lead frame having a die pad, leads with inner and outer lead ends, and a press-fit lead. The press-fit lead has a circular section between an outer lead end and an inner lead end, and the circular section has a central hole that is sized and shaped to receive a press-fit connection pin. A die is attached to the die pad and electrically connected to the inner lead ends of the leads and the inner lead end of the press-fit lead. The die, electrical connections and inner lead ends are covered with an encapsulant that forms a housing. The outer lead ends of the leads extend beyond the housing. The housing has a hole extending therethrough that is aligned with the center hole of the press-fit lead, so that a press-fit connection pin can be pushed through the hole to connect the device to a circuit board.