Press-Fit Terminal Assembly for Power Semiconductor Modules
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Solution Overview
Problem
Conventional intelligent power module (IPM) manufacturing methods involve a large number of solder joining steps, leading to reliability issues due to potential deformation of external connection terminals and lids during assembly.
Innovation Solution
The power semiconductor device employs a press-fit connection between the external connection terminals and the control substrate, reducing the number of solder joining steps and eliminating interference between the lid and external connection terminals, thereby enhancing reliability and manufacturing ease.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder joining steps are used to connect external connection terminals to control substrate, then electrical connection is achieved, but the number of manufacturing steps increases and reliability decreases due to potential deformation
Solution Approach 1:
The patent replaces the solder joining process (thermal/chemical mechanism) with a press-fit mechanical insertion mechanism. The external connection terminal is inserted into a through-hole in the control substrate and fixed by elastic deformation of the terminal body, eliminating soldering steps and associated reliability issues while simplifying manufacturing.
Solution Approach 2:
The patent changes the connection mechanism from permanent solder bonding to reversible press-fit mechanical connection. This parameter change allows for easier manufacturing and repair while maintaining electrical connection reliability, as the terminal can be inserted and fixed without thermal processes.
2Reliability
If lid is fixed to case after external connection terminal is installed, then enclosure is completed, but interference occurs causing deformation of terminal or lid
Solution Approach 1:
The patent applies preliminary action by pre-fixing the external connection terminal to the lid before assembling the lid to the case. The terminal is secured to the lid in advance, and then the integrated lid-terminal assembly is mounted to the case, preventing interference and deformation during final assembly.
3Productivity
If multiple solder joining steps are used, then electrical connections are established, but manufacturing time and production cost increase
Solution Approach 1:
The patent replaces multiple solder joining steps with a single press-fit mechanical insertion process. The external connection terminal is mechanically inserted and fixed to both the control substrate and lid, eliminating the need for repeated soldering operations and significantly improving manufacturing efficiency while enhancing reliability.
Data Source
AI summary
A power semiconductor device includes: a power semiconductor element; a control circuit that controls the power semiconductor element; a control substrate having the control circuit mounted thereon; a lid arranged to overlap with at least a portion of the control substrate in a first direction; and at least one external connection terminal having a first portion connected with the control substrate, a second portion to be connected with an external apparatus, and a third portion located between the first portion and the second portion and fixed to the lid, the first portion being constituted as a press-fit portion.