Press-Fit Terminal Structure for PCB Insertion Force Control
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Solution Overview
Problem
The existing semiconductor devices face issues with external connection terminals coming off the contact components during attachment of a printed circuit board, leading to potential damage and deterioration of electrical insulation due to excessive insertion force.
Innovation Solution
The semiconductor device incorporates contact components with cylindrical through holes and external connection terminals with protrusions on their surfaces, which are pressed by the inner circumferential surface of the through holes, ensuring secure press-fitting and preventing excessive insertion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the printed circuit board is formed of a multilayer board with increased copper plate thickness to handle large currents and increase rigidity, then the electrical current handling capability and rigidity are improved, but the insertion force required to attach the printed circuit board to the external connection terminals increases excessively, causing the external connection terminals to come off the contact components
Solution Approach 1:
The external connection terminal is designed with protrusions at specific locations (corners and intermediate positions) that create localized contact points with the through hole. This distributes the insertion force across multiple discrete points rather than uniformly across the entire interface, allowing the board to be rigid while reducing the peak force transmitted to the contact component connection
Solution Approach 2:
The contact interface is segmented into multiple protrusions rather than a single continuous contact surface. These protrusions are positioned at corners and intermediate locations along the insertion direction, creating discrete force distribution points that prevent excessive force concentration at any single location during attachment
2Reliability
If the insertion force is increased to secure the printed circuit board attachment, then the attachment reliability is improved, but the external connection terminals may come off the contact components, causing damage and deteriorating electrical insulation
Solution Approach 1:
Protrusions are strategically positioned at corners and intermediate locations of the external connection terminal. This creates localized force distribution points that secure the attachment reliably while preventing excessive force from being transmitted to the contact component and insulated board, thus avoiding damage
Solution Approach 2:
The protrusions are pre-formed on the external connection terminal before attachment. This preliminary structural feature ensures that during the attachment process, the force is automatically distributed through these pre-positioned protrusions, preventing the terminal from coming off the contact component while maintaining secure attachment
Data Source
AI summary
A semiconductor device includes a conductive board, a contact component having a cylindrical through hole and including a main body portion with first and second open ends, and an external connection terminal inserted in the through hole of the contact component, having four outer surfaces extending in an insertion direction to form a quadrangular prism shape, and having four corner portions along an insertion direction pressed by an inner circumferential surface of the through hole of the contact component. The external connection terminal has protrusions, each of which is disposed on a respective one of at least one pair of opposite outer surfaces among the four outer surfaces, and being pressed by the inner circumferential surface of the through hole.