Integrated Press Head for Concurrent Chip Package Strain Testing
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Solution Overview
Problem
Current methods for testing semiconductor chip packages face challenges such as inconsistent results, long testing cycles, high costs, and underestimation of packaging strain, particularly when integrating multiple dies within a single packaging unit, which affects mechanical performance and requires separate mechanical and electrical testing.
Innovation Solution
A system and method for simultaneous mechanical and electrical testing of semiconductor chip packages, using an integrated press head with protrusions and conductive pins to apply force and measure electrical properties concurrently, ensuring accurate and efficient evaluation of packaging strain.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate mechanical and electrical testing is performed on semiconductor chip packages, then comprehensive testing coverage is achieved, but testing cycle time increases and productivity decreases
Solution Approach 1:
The patent combines mechanical testing and electrical testing into a single integrated testing system. The press head simultaneously applies mechanical force to the semiconductor chip package while conductive pins establish electrical connections for concurrent electrical measurements, eliminating the need for separate testing operations and reducing total testing time
Solution Approach 2:
The integrated press head serves multiple functions: it applies mechanical loading force, maintains electrical connections through conductive pins, and enables both mechanical and electrical measurements simultaneously. This multi-functional design allows a single testing apparatus to perform what previously required separate specialized equipment
2Measurement precision
If multiple test samples are used for comprehensive testing, then testing accuracy and reliability improve, but testing costs and time consumption increase
Solution Approach 1:
By merging mechanical and electrical testing capabilities into one system, the patent enables simultaneous measurement of both mechanical response and electrical performance on the same sample. This eliminates the need to use separate samples for different test types, reducing total sample requirements and accelerating the testing cycle while maintaining measurement accuracy
3Adaptability or versatility
If conventional testing methods are used for integrated packaging, then existing equipment compatibility is maintained, but mechanical performance assessment accuracy deteriorates due to underestimation of packaging strain
Solution Approach 1:
The patent modifies the testing approach by simultaneously measuring both mechanical parameters (force, displacement) and electrical parameters (resistance, conductivity) under applied strain. This dual-parameter measurement strategy enables accurate assessment of packaging strain effects that conventional single-parameter methods miss, while the system can still interface with standard testing equipment
Data Source
AI summary
Disclosed is an upper press head for mechanical testing and electrical testing of a semiconductor chip package. The upper press head includes: a force receiving component configured to receive a downward force; a force delivering component, having an upper portion connected with the force receiving component and having a first lateral sectional area, and a lower portion having a second lateral sectional area less than the first lateral sectional area; a force applying component connected with the lower portion of the force delivering component and configured to apply the downward force to the semiconductor chip package, the force applying component including: a plurality of protrusions that are laterally separated from each other and are configured to simultaneously press the semiconductor chip package; and a space between two adjacent protrusions matches portions of solder balls of the semiconductor chip package.