Press-On Pin Power Module Assembly for Thermal Contact
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Power semiconductor modules face challenges in achieving good thermal resistance between the substrate and the heat sink or ground surface, are cumbersome to assemble, and have a risk of degraded housing stability, which decreases their lifespan.
Innovation Solution
The semiconductor module arrangement includes a dielectric insulation layer with metallization layers, press-on pins extending vertically from the substrate or semiconductor bodies, mechanically coupled to the housing sidewalls or a printed circuit board, to secure the substrate in place and enhance thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cover is used to press the substrate onto the heat sink, then thermal resistance is improved, but assembly becomes cumbersome and housing stability degrades
Solution Approach 1:
The pressing function is segmented from the cover and assigned to individual press-on pins that are distributed across the substrate. Each pin independently applies pressure to maintain thermal contact, eliminating the need for a complex cover-based pressing mechanism and simplifying assembly.
Solution Approach 2:
The pressing function is extracted from the cover structure and implemented through dedicated press-on pins. This separation allows the cover to focus on enclosure while the pins handle the thermal contact pressure, reducing overall assembly complexity.
2Temperature
If a cover is used to press the substrate onto the heat sink, then thermal resistance is improved, but housing stability degrades
Solution Approach 1:
The pressing function is segmented into multiple distributed press-on pins rather than a single cover-based mechanism. This distribution of pressing points maintains uniform thermal contact pressure while minimizing concentrated forces that could compromise housing stability.
Solution Approach 2:
The pressing function is extracted from the cover and implemented through dedicated pins that are mechanically coupled to the housing. This allows the cover to serve purely as an enclosure while the pins provide stable, controlled pressing force.
3Strength
If soldering or sintering techniques are used to mount semiconductor elements, then mechanical strength is improved, but manufacturing complexity increases
Solution Approach 1:
The press-on pins utilize the inherent mechanical properties of the semiconductor elements themselves (their weight and rigidity) to apply the necessary pressing force. The semiconductor elements serve dual purposes: electrical function and mechanical pressing, eliminating the need for separate complex mounting procedures.
Data Source
AI summary
A power semiconductor module arrangement includes at least one substrate comprising a dielectric insulation layer and a first metallization layer attached to the dielectric insulation layer; at least one semiconductor body arranged on the first metallization layer; a housing at least partly enclosing the substrate, the housing comprising sidewalls; and at least one press-on pin, wherein each press-on pin is arranged either on the substrate or on one of the at least one semiconductor body and extends from the substrate or the respective semiconductor body in a vertical direction that is perpendicular to a top surface of the substrate, and each press-on pin is mechanically coupled to at least one sidewall of the housing by means of a bar, each bar extending horizontally between the respective press-on pin and sidewall, and parallel to the top surface of the substrate.