Press-Pack Semiconductor Structure for Heat Flow and Burr Isolation
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Solution Overview
Problem
Conventional Press Pack IEGT semiconductor devices face challenges in achieving the required junction temperature range of 125° C to 150° C due to difficulties in heat conductivity, leading to potential short circuit failures from burrs formed during manufacturing, which affect reliability.
Innovation Solution
A semiconductor device structure featuring a metal plate with a step or groove portion on its surface, bonded to a conductive sheet with an adhesive, which improves heat conductivity and prevents burrs from contacting control terminals, thereby enhancing reliability and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a metal plate and IEGT chip are pressure welded, then structural strength is improved, but heat conductivity is insufficient and junction temperature requirement cannot be satisfied
Solution Approach 1:
The patent uses a composite structure consisting of a metal plate, conductive sheet, and adhesive layer. The metal plate provides structural strength, the conductive sheet enhances heat conductivity, and the adhesive bonds them together. This composite material approach resolves the contradiction by combining materials with different properties to achieve both strength and thermal performance.
Solution Approach 2:
The conductive sheet acts as an intermediary between the metal plate and IEGT chip. It mediates the thermal transfer from the chip to the metal plate, improving heat conductivity without compromising the structural connection. The adhesive serves as another intermediary that enables the bonding of different materials while maintaining their individual functional properties.
2Temperature
If a conductive sheet is used to bond metal plate and IEGT chip, then heat conductivity is improved, but burrs may contact control terminal causing short circuit failure
Solution Approach 1:
The patent extracts and removes the harmful burrs from the conductive sheet through a dedicated processing step. By taking out the defective portions that could cause short circuits, the reliability issue is resolved while maintaining the heat conductivity function of the conductive sheet.
Solution Approach 2:
The burr removal process is performed as a preliminary action before the conductive sheet is assembled into the final device. This preventive measure eliminates the risk of short circuit failures before they can occur during operation, ensuring reliability while preserving the thermal management function.
3Ease of manufacture
If conventional pressure welding structure is used, then manufacturing simplicity is maintained, but junction temperature requirement of 125-150°C cannot be satisfied
Solution Approach 1:
The patent introduces a composite structure with multiple layers (metal plate, conductive sheet, adhesive) that can be bonded using conventional adhesive bonding processes. This maintains manufacturing simplicity while the conductive sheet component provides the necessary heat conductivity to achieve the required junction temperature range.
Solution Approach 2:
The patent changes the thermal parameter of the bonding interface by introducing a conductive sheet with high thermal conductivity. This parameter change enables the system to achieve the required junction temperature range without fundamentally changing the manufacturing process, as adhesive bonding remains applicable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed structure effectively improves thermal conductivity and reduces the occurrence of short circuit failures, ensuring reliable operation within the desired temperature range while maintaining electrical insulation.
Implementation Method 1
bonded to a conductive sheet with an adhesive
Implementation Method 2
improves heat conductivity
Data Source
AI summary
A semiconductor device according to an embodiment includes: a semiconductor chip; a conductive sheet provided on the semiconductor chip; and a metal plate provided on the conductive sheet. The metal plate has a step portion that is provided on a lateral surface, or a groove portion that is provided on a bottom surface.