Pressed Metal-Sheet Power Inductor for Compact SiP Integration
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Solution Overview
Problem
Existing system in package (SiP) modules face challenges in reducing space size and heat dissipation due to conventional pin disposition on the same plane, limiting efficient integration and heat export, especially in high-power and miniaturized components.
Innovation Solution
A power inductor with a metal magnetic powder core that wraps a winding, having pins on different surfaces, and a preparation method involving high-temperature annealing to reduce loss and facilitate vertical integration, using a metal conductive sheet for reduced resistance and modularization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional power inductor is used, then the basic inductance function is provided, but the inductor generates heat during operation and requires large spacing between adjacent inductors, increasing device area
Solution Approach 1:
A heat dissipation structure is introduced as an intermediary component between the power inductor and the substrate. This heat dissipation structure includes a heat dissipation layer and a heat dissipation cavity that communicates with the external environment, serving as a mediator to transfer heat away from the inductor, thereby reducing heat generation effects and eliminating the need for large spacing between adjacent inductors
Solution Approach 2:
The heat dissipation structure utilizes a porous or cavity-based design where the heat dissipation cavity provides pathways for heat transfer. The heat dissipation layer may have porous characteristics that facilitate heat dissipation through increased surface area and improved thermal conduction to the surrounding environment
2Object-affected harmful factors
If shielding structures are added to reduce electromagnetic interference, then EMI between adjacent inductors is reduced, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The heat dissipation structure serves multiple functions simultaneously: it acts as both a thermal management component (dissipating heat from the inductor) and an electromagnetic shielding structure (reducing EMI between adjacent inductors). This multi-functionality eliminates the need for separate shielding structures, thereby reducing device complexity and manufacturing difficulty while achieving both heat dissipation and EMI reduction goals
3Manufacturing precision
If the inductor is wound with traditional methods, then the inductance is achieved, but the manufacturing precision and consistency of inductance values across batches are poor
Solution Approach 1:
The manual or mechanical winding process is replaced with a magnetic tape deposition process. The magnetic tape containing the conductive pattern is precisely positioned and deposited onto the substrate using automated equipment, eliminating the variability associated with manual winding. This substitution of mechanical winding with a more precise deposition method significantly improves inductance consistency while maintaining ease of manufacture through automation
Solution Approach 2:
The conductive pattern is pre-formed on a magnetic tape before deposition onto the substrate. This preliminary action allows for precise control of the conductor geometry, width, and position during the tape deposition process, ensuring consistent inductance values across different devices and batches while simplifying the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances adaptability and miniaturization of the inductor, improves inductance, and reduces loss, enabling efficient integration and heat dissipation in high-power components, suitable for vertical arrangement in system in package modules.
Implementation Method 1
a magnetic tape is used to deposit a magnetic layer including a conductor pattern on which the conductor is wound in a predetermined pattern
Implementation Method 2
a conductor is wound in a predetermined pattern on a magnetic tape to form a coil pattern
Implementation Method 3
a heat dissipation structure including a heat dissipation layer and a heat dissipation cavity communicating with an external environment
Data Source
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AI summary
This application provides a power inductor, a preparation method of a power inductor, and a system in package module, and the power inductor is applied to the system in package module. The power inductor includes a winding and a metal magnetic powder core. The metal magnetic powder core is configured to support the winding, and the winding uses a metal conductive sheet. During assembly, the metal magnetic powder core is integrated with the winding through pressing, the metal magnetic powder core wraps the winding, and the metal magnetic powder core is insulated from the winding. The winding has a first pin and a second pin, and the first pin and the second pin are exposed on different surfaces of the metal magnetic powder core. Pins are separately disposed on two different surfaces of the power inductor, so that the power inductor can match a system in package module in which components are arranged in different directions. Therefore, disposing of the inductor is facilitated. In addition, the winding is formed by integrally pressing the metal conductive sheet and the metal magnetic powder core, so that inductance of the power inductor is increased, loss of the inductor is reduced, and miniaturization of the inductor is improved.