Pressed Power Supply Module With Metal Interconnects for Heat Dissipation
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Solution Overview
Problem
The increasing demand for computing power in data centers requires higher power density from power supply modules, leading to increased heat flux density and thermal resistance, while maintaining high reliability and efficient heat dissipation.
Innovation Solution
A power supply module structure with a switch assembly layer, magnetic assembly layer, and metal interconnection layer, where the layers are integrally formed through pressing with insulating materials, and the metal interconnection layer covers the assembly body to facilitate electrical connections without traditional welding, enhancing heat dissipation and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the power density of the power supply is increased to meet the computing power demand, then the power supply capability is improved, but the heat flux density and thermal resistance increase, worsening the heat dissipation performance
Solution Approach 1:
The patent transitions from traditional planar power supply layout to a three-dimensional stacked architecture where switch assembly layer, magnetic assembly layer, and capacitor assembly layer are vertically arranged and interconnected through metal interconnection layers. This dimensional change increases power density while distributing heat generation across multiple layers, improving heat dissipation pathways.
Solution Approach 2:
The metal interconnection layer serves multiple functions simultaneously: it provides electrical connection between different assembly layers, acts as a heat dissipation pathway due to its high thermal conductivity, and provides mechanical support for the stacked structure. This multi-functionality resolves the contradiction by integrating power transmission and heat dissipation into a single structural element.
2Reliability
If traditional welding processes are used to connect power supply components, then electrical connection is achieved, but welding defects and reliability issues occur
Solution Approach 1:
The patent replaces the traditional welding process (thermal/chemical bonding) with a mechanical pressing process. The switch assembly layer, magnetic assembly layer, and capacitor assembly layer are mechanically pressed together with the metal interconnection layer to form an integrated structure, eliminating welding operations and associated defects while maintaining electrical connectivity.
Solution Approach 2:
The patent merges multiple separate components (switch assembly, magnetic assembly, capacitor assembly, and metal interconnection layer) into a single integrated power supply module through the pressing process. This consolidation eliminates the need for welding between separate parts while improving structural integrity and reliability.
3Area of stationary object
If the power supply module size is reduced to fit system board constraints, then space utilization is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent addresses the space-heat dissipation contradiction by moving from a two-dimensional planar layout to a three-dimensional stacked configuration. Multiple functional layers are arranged vertically, reducing the horizontal footprint while increasing the vertical heat dissipation pathways through the metal interconnection layers, thus maintaining effective heat dissipation in a compact form factor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a power supply module with high heat dissipation capability and reliability, reducing thermal resistance and eliminating the risk of welding-related failures, while simplifying the production process and improving integration and parallel connection efficiency.
Implementation Method 1
the metal interconnection layer wraps at least a part of the top surface, at least a part of the side surface and at least a part of the bottom surface of the assembly body
Implementation Method 2
the switch assembly layer, the first connecting layer and the magnetic assembly layer are integrally formed through pressing to form an assembly body
Data Source
AI summary
The invention provides a power supply module with high heat dissipation capability and high reliability. Aiming at the problem that when a power supply module and a system board are fixedly welded, internal welding spots are remelted due to high temperature, on one hand, the structure of the power supply module is further optimized, a device layer is formed in a device in the power supply module through plastic packaging or embedded, an insulating dielectric layer is arranged between the two adjacent device layers, and the device layer and the insulating medium are laminated into an assembly body; the metal interconnection layer is arranged on the surface of the assembly body, and electrical connection between devices in the power supply module is achieved; and no metal welding spot exists in the power supply module, and the assembly reliability of the power supply module and the system is improved.