Pressing Airflow Flattening for Precise LED Substrate Bonding
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Solution Overview
Problem
The process of transferring electronic components, such as light-emitting diodes, from one substrate to another requires precise alignment and bonding, with existing methods struggling to maintain substrate flatness during laser processing, affecting the yield of the transfer process.
Innovation Solution
A device with a carrying platform and a pressing airflow generator is used to partially flatten substrates, combined with an energy generator to apply an energy beam through a pressing airflow, ensuring close attachment and bonding of electronic components between substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a laser processing method is used to transfer electronic components from one substrate to another, then the transfer process can be automated and mass manufacturing can be facilitated, but the substrate flatness cannot be maintained during processing, which affects the yield
Solution Approach 1:
The patent employs a pressing airflow generator that utilizes pneumatic principles to generate controlled airflow. The airflow is directed through nozzles onto the substrate surface, creating a pressure differential that presses the substrate against the carrier substrate, maintaining flatness during laser transfer processing.
Solution Approach 2:
The pressing airflow acts as an intermediary between the substrate and the laser processing system. By introducing this intermediate pneumatic field, the system maintains substrate flatness without requiring direct mechanical contact or complex clamping mechanisms that would interfere with the laser processing.
2Manufacturing precision
If substrates are pressed together to maintain flatness during laser processing, then substrate flatness is improved, but the complexity of the device increases due to additional pressing mechanisms
Solution Approach 1:
The patent replaces traditional mechanical pressing systems with a pneumatic airflow-based pressing mechanism. Instead of using complex mechanical arms, springs, or hydraulic presses, the system uses controlled airflow to apply pressure, significantly reducing mechanical complexity while maintaining effective substrate contact.
Solution Approach 2:
By utilizing pneumatic principles, the system achieves substrate pressing functionality with a relatively simple device structure. The airflow generator and nozzle system is much less complex than equivalent mechanical pressing systems, resolving the contradiction between pressing effectiveness and device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively improves the yield of the transfer process by maintaining substrate flatness and enhancing bonding efficiency, allowing for successful transfer and assembly of electronic components like light-emitting diodes.
Implementation Method 1
The air pump can provide an airflow to the airflow guiding channel of the body. The airflow guiding channel can guide the airflow to lift up the body from the carrying platform, thereby creating a pressing airflow between the body and the carrying platform.
Implementation Method 2
The airflow guiding channel can guide the airflow to lift up the body from the carrying platform, thereby creating a pressing airflow between the body and the carrying platform.
Implementation Method 3
The energy generator is disposed near the carrying platform of the device configured to partially flatten the substrate, and configured to generate an energy beam that travels toward the carrying platform through the pressing airflow.
Data Source
AI summary
A device configured to partially flatten a substrate includes a carrying platform and a pressing airflow generator. The carrying platform has a carrying plane and is configured to carry the substrate to be flattened on the carrying plane. The pressing airflow generator includes a body having an airflow guiding channel disposed thereon, an actuator capable of driving the body to move along the carrying plane relative to the carrying platform, and an air pump capable of providing an airflow to the airflow guiding channel of the body. The airflow guiding channel can guide the airflow to lift up the body from the carrying platform, thereby creating a pressing airflow between the body and the carrying platform. An apparatus configured to bond an electronic component and methods for bonding an electronic component and manufacturing a light-emitting diode display are also provided.