Pressing-Type Semiconductor Package Without Solder
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Solution Overview
Problem
Conventional semiconductor packages rely on conductive adhesives like solder, which are temperature-dependent and increase manufacturing costs, and pose inefficiencies in assembly and repair due to the need for discarding entire packages upon defects.
Innovation Solution
A semiconductor power device package is constructed using physical pressing members without adhesives, where metal plates with coupling holes are fastened by pressing members to establish electrical connections, allowing for secure and efficient assembly and disassembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive adhesives like solder are used to establish electrical connections, then electrical connectivity is achieved, but the package becomes temperature-dependent and manufacturing cost increases
Solution Approach 1:
The patent replaces the chemical bonding mechanism of conductive adhesives with a mechanical pressing system. Metal plates are physically pressed against the semiconductor chip using pressing members, eliminating the need for temperature-dependent soldering or adhesive bonding. This mechanical connection method provides stable electrical connectivity without the limitations of material melting points or curing temperatures.
2Reliability
If expensive conductive adhesives like silver sintering or copper paste are employed, then electrical connection quality improves, but manufacturing cost increases
Solution Approach 1:
The patent employs ordinary metal plates and pressing members instead of expensive conductive adhesives. The pressing members can be simple mechanical components that apply force without requiring costly materials. This substitution dramatically reduces material costs while maintaining reliable electrical connections through direct metal-to-chip contact.
3Reliability
If the entire package is discarded upon finding assembly defects, then quality control is maintained, but production efficiency decreases
Solution Approach 1:
The patent designs the package with separable components - the semiconductor chip is mounted on metal plates that are held by pressing members. This modular structure allows the chip to be independently removed or replaced without discarding the entire package. When defects are found, only the problematic chip needs to be replaced, significantly improving production efficiency while maintaining quality control.
4Reliability
If conductive adhesives are used for assembly, then electrical connections are established, but assembly and repair efficiency decreases due to difficulty in disassembly
Solution Approach 1:
The patent employs pressing members that can dynamically adjust and release their holding force on the metal plates. This allows the assembly to be easily disassembled by releasing the pressing members, enabling chip replacement for repair or upgrade. The dynamic nature of the pressing connection contrasts with the permanent bonding of adhesives, providing ease of maintenance while ensuring stable electrical connections during operation.
Data Source
AI summary
The present invention relates generally to a pressing-type semiconductor power device package, and more specifically to a pressing-type semiconductor power device package in which a semiconductor chip, such as a transistor or diode, is formed into a package via a pressing structure without using any conductive adhesive, such as solder, which is used in the past, thereby improving production efficiency and durability.