Pressure Array Sensor Module Density Adjustment via Interlaced Electrodes
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Solution Overview
Problem
The existing thin-type pressure array sensor modules require significant time and cost to customize or adjust the density of sensing elements due to the need for redesigning stencils and repeating the screen printing process for each design change.
Innovation Solution
A pressure array sensor module with an array electrode board and pressure sensing elements, where the electrode patterns can be adjusted to interlace sensing positions, allowing for increased density without re-manufacturing stencils or re-printing, using conductive structures to connect leads and electrode patterns for modularization and flexible orientation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the density of sensing elements is customized or adjusted, then the sensing performance is improved, but the manufacturing time and cost increase significantly
Solution Approach 1:
The sensing element array is divided into multiple independently printable units that can be selectively activated. The substrate is segmented into different sensing zones with varying densities, allowing customization without re-manufacturing the entire array. This enables selective printing of conductive structures only in required areas.
Solution Approach 2:
The patent implements a dynamic configuration system where the electrode patterns and conductive structures can be reconfigured through software control rather than physical re-manufacturing. The system allows real-time adjustment of sensing element density and orientation by selectively activating different regions of the printed array.
2Manufacturing precision
If the density of sensing elements is customized or adjusted, then the sensing performance is improved, but the manufacturing cost increases
Solution Approach 1:
A single printed substrate serves multiple functions: it contains the entire sensing element array, interconnect structures, and electrode patterns that can be reconfigured for different applications. The same physical substrate can be used for various sensing element densities and orientations through software-controlled activation, eliminating the need for multiple custom-manufactured arrays.
Solution Approach 2:
The patent changes the operational parameters of the sensing array through software rather than physical manufacturing changes. By modifying the activation patterns of conductive structures and electrode connections, different sensing element densities and orientations are achieved without altering the physical substrate, significantly reducing manufacturing costs.
3Manufacturing precision
If stencils are re-designed for each customization, then the sensing element density is adjusted, but the device complexity increases
Solution Approach 1:
Instead of creating new physical stencils for each customization, the patent uses digital copying and selective activation of pre-printed patterns. The conductive structures are virtually 'copied' and activated only in the required regions through software control, eliminating the need for multiple custom stencil designs and their associated complexity.
Data Source
AI summary
A pressure array sensor module, comprising an array electrode board, a plurality of pressure sensing elements, at least one first conductive structure and at least one second conductive structure is provided. The array electrode board comprises a substrate and an electrode array disposed on the substrate and having a first electrode pattern and a second electrode pattern. Each pressure sensing element is disposed at a sensing position on the array electrode board, and comprises a top electrode layer, a bottom electrode layer and at least one pressure sensing layer disposed between the top electrode layer and the bottom electrode layer. The top electrode layer has a first lead. The bottom electrode layer has a second lead. The first conductive structure electrically connects the first lead and the corresponding first electrode pattern. The second conductive structure electrically connects the second lead and the corresponding second electrode pattern.