Pressure Balancing Clamp for Press-Pack IGBT Modules
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Solution Overview
Problem
Current press-pack IGBT module clamps lack uniform pressure distribution, leading to increased thermal and contact resistance, and have complex structural layers that complicate installation and adjustment.
Innovation Solution
A pressure balancing clamp with slidably installed pressure equalizing plates connected by hydraulic devices and pressure sensors, which adjust pressure independently in four directions to ensure uniform pressure distribution, and includes heat dissipation and confluence devices to reduce device layers and enhance reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a pressure sensor is used to measure the total pressure applied by the clamps, then the total pressure measurement is achieved, but the uniformity of pressure in all directions cannot be measured
Solution Approach 1:
The patent divides the pressure measurement system into multiple independent pressure sensors arranged in an array, with each sensor measuring pressure in a specific direction. This segmentation allows the system to capture pressure distribution uniformity across all directions, overcoming the limitation of a single total pressure measurement while maintaining measurement precision.
2Reliability
If the clamp applies high surface pressure to reduce thermal contact resistance and contact resistance, then the electrical and thermal performance is improved, but the chips may be crushed
Solution Approach 1:
The patent employs multiple pressure sensors positioned at different locations to detect local pressure variations. Based on the feedback from these sensors, the clamp adjusts pressure distribution locally to ensure each chip receives appropriate pressure - sufficient to reduce contact resistance but not excessive to cause crushing. This localized pressure control maintains module reliability while preventing chip damage.
Solution Approach 2:
The patent implements a feedback control system where pressure sensors continuously monitor the pressure applied to chips, and the clamp adjusts its pressure output based on this feedback. This closed-loop control ensures pressure remains within the optimal range to prevent chip crushing while maintaining low contact resistance, thereby improving reliability without causing harmful effects.
3Object-affected harmful factors
If the clamp applies low surface pressure to avoid chip crushing, then the chip safety is improved, but the thermal contact resistance and contact resistance increase, resulting in junction temperature rising
Solution Approach 1:
The patent uses locally positioned pressure sensors to detect pressure conditions at each chip location and adjusts pressure application locally accordingly. This ensures each chip receives the precise pressure needed to maintain low thermal and contact resistance without exceeding the threshold that would cause damage, thereby controlling junction temperature while preventing chip damage.
Solution Approach 2:
The feedback mechanism continuously monitors pressure and temperature conditions, adjusting clamp pressure in real-time to maintain optimal operating parameters. This prevents both chip crushing and excessive temperature rise by keeping pressure within the narrow optimal range, simultaneously addressing both concerns.
4Stability of the object's composition
If a pressure equalizing plate is used to provide uniform pressure to the press-pack module, then the pressure distribution is improved, but the structural layers increase, making installation and disassembly complicated
Solution Approach 1:
The patent integrates multiple functions into a single clamp structure: pressure application, pressure distribution equalization, and pressure measurement. By combining the pressure equalizing plate with an array of pressure sensors and control mechanisms in one unified device, the patent achieves uniform pressure distribution without increasing the number of separate structural layers, thereby simplifying installation and disassembly while maintaining pressure stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The clamp achieves uniform pressure distribution, improves the reliability of the press-pack IGBT module, simplifies pressure application, and maintains high heat dissipation efficiency by avoiding liquid medium current paths.
Implementation Method 1
upper and lower ends of the bracket are connected with the pressure equalizing plates through hydraulic devices
Implementation Method 2
the pressure sensors are longitudinally arranged in one-to-one correspondence with the hydraulic devices, and the longitudinally corresponding hydraulic devices are electrically connected with the pressure sensors
Implementation Method 3
opposite surfaces of the two pressure equalizing plates are respectively provided with heat dissipation and confluence devices
Data Source
AI summary
Disclosed is a pressure balancing clamp for a press-pack insulated gate bipolar transistor (IGBT) module. The pressure balancing clamp for a press-pack IGBT module includes a bracket, where the bracket is provided with two longitudinally arranged pressure equalizing plates in a sliding way; the pressure equalizing plates are connected through pressure sensors; the upper and lower ends inside the bracket are respectively connected with the pressure equalizing plates through hydraulic devices and a displacement compensation device; opposite surfaces of the two pressure equalizing plates are respectively provided with heat dissipation and confluence devices. The pressure sensors are in one-to-one correspondence with the hydraulic devices and are electrically connected. The hydraulic devices adjust the pressure according to the readings of the pressure sensors in corresponding directions, so that the pressure of the press-pack IGBT module is balanced.