Pressure-Sensitive Circuit Board Layout for Thin Accurate Sensing
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Solution Overview
Problem
Existing pressure sensors have a large support body height that increases their thickness, hindering miniaturization due to the need for a sufficient gap to accommodate the deformed strain material.
Innovation Solution
A pressure-sensitive circuit board design with conductive convex blocks and strain members that form receiving spaces to accommodate deformed strain bodies, reducing overall thickness and enhancing sensitivity and accuracy by dividing the pressing area into multiple sub-areas with varying deformation degrees.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the support body height is increased to provide sufficient gap for deformed strain material, then the strain material can be properly accommodated, but the pressure sensor thickness increases and miniaturization is hindered
Solution Approach 1:
The pressing area is divided into multiple sub-pressing areas, each with its own support body and receiving space. This segmentation allows the strain material to be distributed across multiple smaller gaps rather than requiring one large gap, thereby reducing the height of individual support bodies while maintaining reliable accommodation of deformed strain material.
Solution Approach 2:
The patent transitions from a single large receiving space to multiple smaller receiving spaces arranged in a matrix pattern across the pressing area. This dimensional redistribution allows the total volume needed for strain material accommodation to be maintained while reducing the vertical height requirement of individual support bodies.
2Length of stationary object
If the support body height is reduced to enable miniaturization, then the pressure sensor thickness decreases, but the gap for receiving deformed strain material becomes insufficient
Solution Approach 1:
By segmenting the pressing area into multiple sub-pressing areas with corresponding support bodies, the patent creates multiple smaller receiving spaces that collectively provide sufficient volume for strain material accommodation. Each support body can be shorter while the array of support bodies together provides the necessary total capacity.
Solution Approach 2:
Different regions of the pressing area have different local configurations of support bodies and receiving spaces. The local quality of each sub-area is optimized to accommodate strain material deformation characteristics specific to that region, allowing shorter support body heights while maintaining overall reliability.
3Measurement precision
If the pressing area is divided into multiple sub-pressing areas with different deformation degrees, then sensitivity and accuracy are improved, but the device complexity increases
Solution Approach 1:
The pressing area is segmented into multiple sub-pressing areas, each with support bodies arranged in specific patterns. This segmentation enables different deformation characteristics in different regions, improving measurement precision through spatial differentiation while maintaining a relatively simple repetitive structure.
Solution Approach 2:
The support bodies and receiving spaces are designed with universal characteristics that can be replicated across multiple sub-pressing areas. The same basic unit of support body and receiving space is used throughout, allowing the complex multi-sub-area structure to be built from simple modular components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design allows for a thinner pressure sensor with improved sensitivity and accuracy by separately receiving deformed strain bodies in defined spaces, delaying resistance changes, and protecting strain bodies from sudden separation.
Implementation Method 1
The strain member is deformable by an external force, and each of the receiving space is configured to receive at least a portion of the strain member when the stain member is deformed
Data Source
AI summary
The present application provides a pressure-sensitive circuit board, including a circuit substrate, a number of conductive convex blocks, and a strain member. The circuit substrate includes a dielectric layer and a conductive wiring layer on the dielectric layer. The conductive convex blocks are spaced from each other on the conductive wiring layer. A receiving space is defined between adjacent conductive convex blocks. The strain member is formed on the conductive convex blocks and covers the receiving space. The strain member can be deformed under an external force. The receiving space can receive at least a portion of the strain member. The present application further provides a manufacturing method for the pressure-sensitive circuit board. The present application further provides a pressure sensor.