Pressure Body Uniform Load Distribution for Photomask Pellicle
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Solution Overview
Problem
The miniaturization of semiconductor devices leads to increased sensitivity in exposure pattern formation, where non-uniform pressure loads on the adhesive layer between the photomask and the pellicle assembly cause strain, affecting image formation positions during the semiconductor fabrication process.
Innovation Solution
A pressure body with multiple contact members and a buffer member system that adjusts to reduce parallelism between pressure planes, ensuring a more uniform pressure load distribution across the adhesive layer, thereby minimizing strain on the photomask's exposure pattern region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional pressure body is used to pressurize the photomask and pellicle assembly, then the mounting process can be completed, but non-uniform pressure load distribution causes strain on the adhesive layer and exposure pattern region
Solution Approach 1:
The pressure body is divided into multiple contact members (first contact member, second contact member, third contact member, fourth contact member) positioned at different locations. Each contact member independently applies pressure to different regions of the photomask and pellicle assembly, allowing the system to achieve uniform pressure distribution across the entire surface by coordinating the action of multiple segments rather than relying on a single pressure application point.
Solution Approach 2:
A buffer member is introduced as an intermediary component between the contact members and the photomask/pellicle assembly. The buffer member receives pressure from the contact members and redistributes it uniformly across the adhesive layer and exposure pattern region, acting as a mediator that transforms the pressure application mechanism to achieve uniform load distribution without requiring the contact members to directly contact the sensitive surfaces.
2Ease of operation
If the photomask is held horizontally with chromium surface facing downward, then the mounting process is simplified, but the exposure pattern region is still susceptible to strain from non-uniform pressure
Solution Approach 1:
The pressure application system is segmented into multiple contact members positioned at different locations on the photomask. This segmentation allows the system to maintain the simple horizontal holding position while distributing pressure uniformly across the exposure pattern region, preventing strain that would otherwise affect image formation position accuracy.
Solution Approach 2:
The buffer member serves as an intermediary that receives pressure from the contact members and redistributes it uniformly across the adhesive layer and exposure pattern region. This intermediary mechanism allows the photomask to be held in the simple horizontal position while ensuring that the sensitive exposure pattern region experiences uniform pressure distribution, thereby maintaining image formation position accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution achieves a more uniform pressure load distribution, reducing deformation of the adhesive layer and minimizing strain on the photomask's exposure pattern region, thus maintaining accurate image formation positions during the semiconductor fabrication process.
Implementation Method 1
a buffer member located between the contact members and the cover body in the pressure direction
Implementation Method 2
the parallelism between a pair of pressure planes when received a pressure load
Data Source
AI summary
A pressure body comprises: three or more pressure pins 40 that come into contact with a photomask 70 at downward positions in a pressure direction D; a main body 10 provided with an opening 16, the opening 16 supporting the pressure pins 40 so as to prevent the pins from dropping off downward, the opening 16 being able to change positions within a plane perpendicular to the pressure direction D, the pressure pins 40 being supported at said positions; a cover body 20 fixed to the main body 10 at an upward position in the pressure direction D; and a buffer member 30 located between the pressure pins 40 and the cover body 20 in the pressure direction D. The pressure body further comprises a cap pin 60, the cap pin 60 supported in the opening 16 so as to be prevented from dropping off downward, the cap pin 60 located in alignment with the pressure pins 40 so as to close off the opening 16, thereby preventing the buffer member 30 from being exposed downward.