Pressure Control for Uniform Microelectronic Substrate Treatment
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Solution Overview
Problem
Existing microelectronic substrate treatment systems face challenges in achieving uniform process performance and chamber matching due to variations in pressure and flow rate control, leading to inconsistent cleaning efficiency and potential damage to sensitive device features.
Innovation Solution
Implementing pressure control strategies that adjust mass flow rate in response to pressure readings to maintain constant pressure uniformity, rather than maintaining a constant mass flow rate, which allows for precise control of the pressure differential and flow dynamics to enhance cleaning efficiency and chamber matching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If constant mass flow rate is maintained, then flow rate stability is improved, but pressure uniformity deteriorates due to hardware variations
Solution Approach 1:
The system transitions from controlling mass flow rate to controlling pressure as the primary parameter. By maintaining constant pressure rather than constant flow rate, the system compensates for hardware variations and achieves uniform treatment streams across different chambers and conditions
Solution Approach 2:
Pressure sensors provide real-time feedback on chamber pressure and feed pressure, which is used by control systems to dynamically adjust mass flow rate. This closed-loop control ensures pressure uniformity is maintained despite variations in hardware or operating conditions
2Manufacturing precision
If pressure control strategies are implemented, then pressure uniformity is improved, but system complexity increases
Solution Approach 1:
The system replaces complex mechanical flow control mechanisms with pressure-based control using sensors and electronic control systems. This substitution simplifies the overall system while achieving better control precision through electronic feedback loops
3Productivity
If mass flow rate is increased to improve cleaning efficiency, then cleaning performance is improved, but risk of damaging sensitive structures increases
Solution Approach 1:
The system changes the control parameter from mass flow rate to pressure, enabling independent optimization of cleaning efficiency and safety. By controlling pressure uniformly, the system ensures consistent cleaning performance without exceeding damage thresholds, as pressure can be precisely regulated regardless of flow rate variations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the uniformity and repeatability of treatment processes, reduces the impact of hardware variations, and enhances chamber matching, resulting in better cleaning performance and reduced risk of damaging sensitive structures.
Implementation Method 1
When the pressurized and cooled fluid is dispensed from the nozzle into the lower pressure regime of the chamber, the fluid is converted into energetic, high velocity streams
Implementation Method 2
The chamber often is under vacuum
Data Source
AI summary
The present invention provides techniques to more accurately control the process performance of treatments in which microelectronic substrates are treated by pressurized fluids that are sprayed onto the substrates in a vacuum process chamber control strategies are used that adjust mass flow rate responsive to pressure readings in order to hold the pressure of a pressurized feed constant. In these embodiments, the mass flow rate will tend to vary in order to maintain pressure uniformity.