Pressure-Cycling Processing Chamber for Bubble-Free Thermal Uniformity
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Solution Overview
Problem
Conventional methods for removing bubbles from materials during electronic product manufacturing, such as vacuuming, often lead to temperature uniformity issues and control inaccuracies, reducing the reliability and yield of the products.
Innovation Solution
A material processing apparatus that includes a processing chamber with a controller to alternately apply positive and negative pressure, along with a temperature regulator, to achieve uniform temperature distribution and bubble removal, thereby improving the reliability and yield of electronic products.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If negative pressure action (vacuuming) is used to remove bubbles, then bubble removal is achieved, but temperature uniformity of the material is reduced
Solution Approach 1:
The patent applies periodic action by alternating between positive pressure (bubble removal phase) and negative pressure (vacuuming phase) in a cyclic manner. The controller switches between the pressure generation unit and vacuum generation unit at different time points, creating a periodic pressure variation that enables both effective bubble removal and temperature uniformity maintenance through the heating phase.
Solution Approach 2:
The patent applies preliminary action by performing positive pressure bubble removal before the material cooling phase, and applying negative pressure before the material heating phase. This sequencing ensures that bubbles are removed at optimal moments and temperature uniformity is maintained through pre-heating actions, improving both reliability and temperature control.
2Reliability
If negative pressure action (vacuuming) is used to remove bubbles, then bubble removal is achieved, but control accuracy is reduced
Solution Approach 1:
The patent applies feedback by using the temperature detection unit to continuously monitor material temperature and feed this information back to the controller. The controller then adjusts the heating power or vacuum/pressure application based on the detected temperature, ensuring accurate temperature control and measurement during the bubble removal process.
Solution Approach 2:
The patent applies dynamics by making the pressure and temperature control parameters adjustable and time-dependent. The controller dynamically switches between different pressure states and heating powers based on the processing stage, enabling accurate control of both bubble removal and temperature measurement throughout the process.
3Measurement precision
If positive pressure is applied to improve temperature uniformity, then temperature measurement accuracy is improved, but bubble removal capability is reduced
Solution Approach 1:
The patent resolves this contradiction by applying positive pressure and negative pressure in periodic alternation. During the positive pressure phase, temperature uniformity is improved and measurements are accurate; during the negative pressure phase, bubbles are effectively removed. This periodic switching ensures both temperature accuracy and bubble removal are achieved at different stages of the process.
Solution Approach 2:
The patent applies preliminary action by performing bubble removal through negative pressure before the heating and temperature measurement phase. This sequencing ensures that bubbles are removed in advance, allowing subsequent temperature measurements to be accurate without interference from bubble presence.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus ensures a uniform temperature throughout the material, reducing temperature measurement errors and allowing accurate parameter switching, which enhances the reliability and yield of electronic products by effectively removing bubbles.
Implementation Method 1
the controller controlling the external pressure source to increase the pressure in the processing chamber from the normal pressure to the first predetermined pressure
Implementation Method 2
the vacuum generator being connected to the processing chamber for negative pressure action on the internal space
Data Source
AI summary
A material processing apparatus includes a processing chamber having an internal space, an external pressure source, a vacuum generator, a temperature regulator and a controller. The external pressure source is connected to the processing chamber for positive pressure action on the internal space. The vacuum generator is connected to the processing chamber for negative pressure action on the internal space. The temperature regulator is arranged in the processing chamber to adjust the temperature in the internal space. The controller is configured to control the external pressure source to increase the pressure in the processing chamber from a normal pressure to a first predetermined pressure, and configured to control the vacuum generator to reduce the pressure in the processing chamber to a second predetermined pressure less than the normal pressure after the pressure rises to the first predetermined pressure. An operating method of a material processing apparatus is also provided.