Pressure Sensing Device With Cut-Out Patterns For Concentrated Force
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Solution Overview
Problem
Existing pressure sensing devices have complex structures, complicated manufacturing processes, high costs, and low touching accuracy, which hinder their widespread adoption and use.
Innovation Solution
A pressure sensing device with a top panel, a first sensing board member featuring cut-out patterns to concentrate pressure, and a control circuit board connected to a second sensing board member, allowing for accurate pressure detection and simple operation through a connecting material and electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If complex circuit designs and structural designs are used to form sensing device bodies, then the pressure sensing device can achieve basic functionality, but the structure becomes complex and the manufacturing process becomes complicated
Solution Approach 1:
The patent merges the circuit board and sensing structure into a single integrated unit. The circuit board itself serves as the sensing structure, with sensing elements directly positioned on it. This eliminates the need for separate sensing components and their associated mounting structures, thereby simplifying the overall device structure while maintaining sensing functionality.
Solution Approach 2:
The circuit board is designed to perform multiple functions simultaneously: it serves as both the electrical circuit carrier and the mechanical sensing structure. The board's rigid structure provides both electrical connectivity and the necessary mechanical properties for pressure sensing, reducing the need for additional specialized components.
2Measurement precision
If strict control of distance between capacitance contacts and panel is implemented, then pressure information can be obtained through distance variation, but extremely high machining accuracy and assembly accuracy are required
Solution Approach 1:
The patent changes the sensing mechanism from measuring distance variation to measuring direct pressure force. By using sensing elements that respond to applied pressure rather than distance changes, the system achieves pressure detection accuracy without requiring extremely tight control over component spacing and alignment during manufacturing.
Solution Approach 2:
The patent replaces the capacitive distance-measurement mechanism with a direct mechanical pressure sensing approach. Instead of measuring electrical capacitance changes caused by distance variation, the system uses sensing elements that directly detect pressure forces, simplifying the measurement mechanism and reducing manufacturing precision requirements.
3Measurement precision
If piezoelectric ceramic pieces are used to obtain pressure values through instantaneous impact, then pressure sensing can be achieved, but uniform piezoelectric ceramic pieces must be mounted by special assembly methods
Solution Approach 1:
The patent replaces expensive, specialized piezoelectric ceramic pieces with more economical sensing elements that can be easily mounted on standard circuit boards. The sensing elements used are simpler, more tolerant of manufacturing variations, and can be assembled using conventional methods rather than special assembly procedures.
Solution Approach 2:
The patent changes from using piezoelectric materials that require instantaneous impact to sensing elements that respond to sustained pressure. This parameter change allows for more flexible mounting options and eliminates the need for precise impact timing and special assembly techniques required by piezoelectric ceramics.
4Measurement precision
If strain gauges are selected and combined into circuit structures with glue connection, then pressure sensing can be achieved, but the sensing structure needs accurate positioning and careful adhesion due to small deformation amounts
Solution Approach 1:
The patent merges the strain gauge circuit structure with the main circuit board, eliminating the need for separate gauge assemblies that require precise positioning and gluing. The sensing elements are integrated directly into the board structure, allowing for more tolerant positioning and simpler assembly processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution simplifies the structure and manufacturing process, reduces costs, and enhances touching accuracy, making the pressure sensing device easier to use and more accessible for various applications.
Implementation Method 1
the first sensing board member is provided thereon with cut-out regions configured to concentrate the external pressure, each cut-out pattern comprises a pressure concentration point position configured for concentrating the external pressure at a point location
Implementation Method 2
the applied force will be transferred to the second sensing board member
Data Source
AI summary
A pressure sensing device of the present invention comprises a top panel, a first sensing board member, a second sensing board member, and a control circuit board. The first sensing board member is provided with cut-out patterns, comprising pressure concentration point positions. The upper surface of the first sensing board member with cut-out patterns is connected via a first connecting material to the top panel. The second sensing board member is connected to a lower surface of the first sensing board member. The control circuit board is electrically connected to a second sensing board member. The present application also provides an area pressure measuring apparatus, a touch control board, and a display apparatus.