Pressure Sensing Module Eliminates Wires for Case Closure Detection
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Solution Overview
Problem
Existing pressure sensing devices for electronic devices require bulky wires and additional fasteners, increasing costs and assembly time, while failing to effectively detect case closure due to wire movement and contact issues.
Innovation Solution
A pressure sensing module comprising a conductive pad, an elastic cover, a pushing part, and a conductive unit, where the conductive unit touches the conductive pad only when pressure is applied, eliminating the need for wires and using an elastic cover to ensure reliable electrical connection without the need for additional fasteners.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a wire is used to connect the pressure sensing button to the circuit board, then the sensing signal can be transmitted, but the wire occupies large space and requires additional fasteners, increasing device complexity and cost
Solution Approach 1:
The patent extracts and removes the wire from the pressure sensing device, replacing it with a direct integrated connection between the pressure sensing button and the circuit board. This eliminates the need for wire arrangement and fasteners, reducing device complexity while maintaining sensing signal transmission reliability
Solution Approach 2:
The patent merges the pressure sensing button and the circuit board into a single integrated structure, where the button is directly mounted on the circuit board. This consolidation eliminates the wire connection and reduces the number of components, thereby reducing device complexity and assembly requirements
2Reliability
If a wire is used in the pressure sensing device, then the sensing function can be implemented, but the assembly time increases due to wire arrangement requirements
Solution Approach 1:
The patent removes the wire from the pressure sensing device, eliminating the time-consuming wire arrangement step during assembly. The integrated design allows for direct mounting of the pressure sensing button on the circuit board, significantly reducing assembly time while maintaining the pressure sensing function
Solution Approach 2:
The patent incorporates the pressure sensing button directly onto the circuit board during the board manufacturing process, before final device assembly. This preliminary integration eliminates the need for separate wire arrangement steps during device assembly, improving productivity
3Stability of the object's composition
If a fastener is used to secure the wire, then the wire can be prevented from moving, but the cost of the electronic device increases
Solution Approach 1:
The patent extracts and eliminates the fastener from the pressure sensing device by removing the wire entirely. The integrated design where the pressure sensing button is directly mounted on the circuit board eliminates the need for fasteners, reducing material costs while maintaining structural stability
Solution Approach 2:
The patent merges the pressure sensing button and circuit board into an integrated structure, eliminating the wire and fastener components. This consolidation reduces the bill of materials and overall device cost while maintaining the stability of the pressure sensing function through direct mounting
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces space occupation and assembly time, lowers costs by eliminating wire requirements, and effectively detects case closure and separation, allowing for accurate recording of disassembly events.
Implementation Method 1
The elastic cover is connected to the circuit board and located above the conductive pad. The elastic cover includes a top end. The pushing part is connected to the top end... When the pushing part is under pressure and moves toward the conductive pad, the pushing part causes the conductive unit to move toward the conductive pad
Data Source
AI summary
A pressure sensing module for sensing a pressure applied to a circuit board is disclosed. The pressure sensing module includes a conductive pad, an elastic cover, a pushing part and a conductive unit. The conductive pad is connected to the circuit board. The elastic cover is connected to the circuit board and located on the conductive pad. The elastic cover includes a top end. The pushing part is connected to the top end. The conductive unit is located above the conductive pad. When the pushing part is not under pressure, the conductive unit does not move to touch the conductive pad. When the pushing part is under pressure, the pushing part causes the conductive unit to move toward the conductive pad such that the conductive unit touches the conductive pad.