Pressure-Sensitive Adhesive Composition for OLED Corrosion Control
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Solution Overview
Problem
Organic electronic devices (OEDs) are susceptible to damage from moisture and ionic substances, leading to oxidation and electrochemical corrosion, which affects their durability and lifetime.
Innovation Solution
A pressure-sensitive adhesive composition is developed to control volatile organic compounds (VOCs) and ionic substances, with specific limits on their amounts, using a resin with a water vapor transmission rate (WVTR) of 50 g/m²·day or less, and includes components like photoinitiators, tackifier resins, and silane coupling agents to enhance adhesion and moisture barrier properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional encapsulants are used to protect OLEDs from moisture, then moisture barrier performance is improved, but organic volatile substances in the encapsulant may damage organic light emitting materials or electrode parts
Solution Approach 1:
The patent changes the chemical composition parameters of the pressure-sensitive adhesive by selecting specific resin types (polyolefin, polyester, polyamide, acrylic, or vinyl chloride resin) and controlling the content of organic volatile substances and ionic substances within defined ranges, thereby achieving low VOC emission while maintaining moisture barrier performance
Solution Approach 2:
The patent creates a composite pressure-sensitive adhesive system by combining specific resin types with controlled amounts of organic volatile substances and ionic substances, where the synergistic effect of these components achieves both moisture barrier protection and low VOC emission properties
2Reliability
If encapsulants with high moisture barrier properties are selected, then protection from moisture penetration is improved, but ionic substances in the encapsulant may cause electrochemical corrosion
Solution Approach 1:
The patent controls the ionic substance content within specific ranges (Na: 10-500 ppm, K: 10-500 ppm, Cl: 10-500 ppm) while selecting resin types with inherent moisture barrier properties, thereby achieving protection from moisture penetration while minimizing electrochemical corrosion risk
3Strength
If a pressure-sensitive adhesive composition is applied to encapsulate the organic electronic device, then adhesion and sealing performance are improved, but volatile organic compounds and ionic substances may enter the device and cause damage
Solution Approach 1:
The patent optimizes the chemical composition parameters by selecting specific resin types and controlling the content of organic volatile substances (0.1-5.0 wt%) and ionic substances within defined ranges, thereby achieving adequate adhesion and sealing performance while minimizing harmful emissions
Solution Approach 2:
The patent applies different quality requirements to different aspects of the pressure-sensitive adhesive: high adhesion strength at the bonding interface, low VOC content in the bulk material, and controlled ionic substance levels, thereby achieving multiple performance goals simultaneously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively prevents physical and chemical damage to OEDs by minimizing VOCs and ionic substances, improving the device's durability and lifetime by reducing moisture penetration and electrochemical corrosion.
Implementation Method 1
using a resin with a water vapor transmission rate (WVTR) of 50 g/m²·day or less
Implementation Method 2
includes components like photoinitiators
Implementation Method 3
includes components like photoinitiators, tackifier resins, and silane coupling agents to enhance adhesion and moisture barrier properties
Data Source
Figure 1
AI summary
The present invention relates to a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film including the same, and provides a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film which may prevent damage to an element from moisture contained in the composition, ionic substances, and other foreign substances, and effectively block electrochemical corrosion, thereby improving a lifetime and durability of an organic electronic device.