Pressure-Sensitive Adhesive Composition for Organic Electronic Device Encapsulation
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Solution Overview
Problem
Organic electronic devices, such as OLEDs, face durability issues due to oxidation from external factors like water and humidity, requiring an encapsulant that prevents moisture and oxygen penetration while maintaining reliability under high temperature and humidity conditions and ensuring excellent optical characteristics.
Innovation Solution
A pressure-sensitive adhesive composition comprising a copolymer of diene and olefin-based compounds with a multifunctional active energy ray-polymerizable compound, which forms a specific crosslinking structure to enhance moisture barrierability, humidity resistance, and optical characteristics, including a silane compound for improved interface strength and a tackifier for compatibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If polyisobutylene-based pressure-sensitive adhesive is used, then moisture barrierability is improved, but processability and handleability deteriorate
Solution Approach 1:
The patent modifies the chemical structure of the pressure-sensitive adhesive by introducing a specific copolymer composition with diene and olefin-based compounds, and controlling the glass transition temperature to be -50°C or lower. This parameter change enables the adhesive to maintain moisture barrierability while improving processability and handleability through adjusted molecular mobility and flexibility.
Solution Approach 2:
The patent uses a copolymer composition combining diene and olefin-based compounds, creating a composite material structure that integrates the moisture barrier properties of polyisobutylene with the enhanced processability provided by the copolymer architecture and specific glass transition temperature characteristics.
2Reliability
If encapsulation is enhanced to prevent moisture penetration, then reliability under high temperature and humidity is improved, but optical characteristics deteriorate
Solution Approach 1:
The patent optimizes the glass transition temperature parameter to -50°C or lower, which maintains the adhesive in a flexible state that provides good optical transparency while ensuring reliable encapsulation performance under high temperature and humidity conditions. This parameter control allows simultaneous achievement of both reliability and optical characteristics.
3Object-affected harmful factors
If crosslinking structure is formed to improve moisture barrierability, then moisture and oxygen penetration prevention is improved, but haze increases
Solution Approach 1:
The patent controls the glass transition temperature to -50°C or lower, which maintains the crosslinked network structure in a flexible state that prevents moisture and oxygen penetration while minimizing light scattering. This parameter optimization reduces haze caused by rigid crosslinking, preserving optical transparency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents moisture and oxygen ingress, ensuring the reliability and optical performance of organic electronic devices under harsh conditions, with improved mechanical properties and extended panel lifetime.
Implementation Method 1
a multifunctional active energy ray-polymerizable compound which can form a specific crosslinking structure
Data Source
Figure 1~3
AI summary
Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively prevent moisture or oxygen added to an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.