Pressure-Sensitive Adhesive for Flexible Devices
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Solution Overview
Problem
Existing pressure-sensitive adhesives struggle to balance elastic modulus, recovery properties, cuttability, and workability, especially in flexible devices that undergo repeated deformation and temperature changes.
Innovation Solution
A pressure-sensitive adhesive comprising a cross-linked acrylic copolymer with a specific monomer composition, including an alkyl (meth)acrylate unit, a long-chain alkyl (meth)acrylate unit, and a polar functional group-containing unit, which exhibits a low storage elastic modulus at low temperatures and a high storage elastic modulus at high temperatures, along with a suitable peel force.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the elastic modulus of the pressure-sensitive adhesive is lowered to improve deformation followability, then the adhesive can effectively follow repeated deformation, but the recovery property when deformation force disappears deteriorates
Solution Approach 1:
The patent applies parameter changes by controlling the elastic modulus to vary with temperature. The adhesive is designed to have low elastic modulus at low temperatures (improving deformation followability) and high elastic modulus at high temperatures (improving recovery property). This temperature-dependent parameter adjustment allows the adhesive to adapt its mechanical properties to different operational conditions, resolving the contradiction between deformation followability and recovery property.
2Ease of operation
If the elastic modulus is increased to improve cuttability and workability, then the adhesive maintains desired cuttability and workability, but the peel force is lowered
Solution Approach 1:
The patent utilizes parameter changes by making the elastic modulus temperature-dependent. At high temperatures, the adhesive exhibits high elastic modulus to ensure good cuttability and workability. At low temperatures, the elastic modulus decreases to maintain adequate peel force. This dynamic parameter adjustment allows the adhesive to optimize different mechanical properties for different operational conditions, resolving the contradiction between cuttability and peel force.
3Adaptability or versatility
If the elastic modulus is lowered to improve deformation followability at low temperature, then the adhesive responds better to deformation, but the recovery property and high temperature performance deteriorate
Solution Approach 1:
The patent implements parameter changes by designing the adhesive with temperature-dependent elastic modulus. The adhesive composition includes specific components that enable the elastic modulus to be low at low temperatures (improving deformation response) and high at high temperatures (improving recovery performance). This allows the adhesive to maintain optimal performance across different temperature ranges, resolving the contradiction between low-temperature deformation response and high-temperature recovery performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive effectively responds to repeated deformation and recovery in flexible devices, maintaining excellent cuttability, workability, and optical transparency without defects such as lifting, delamination, or bubble generation.
Implementation Method 1
exhibits a low storage elastic modulus at low temperatures and a high storage elastic modulus at high temperatures
Data Source
AI summary
The present application may provide a pressure-sensitive adhesive, which is applied to a flexible device, thereby effectively responding to repeated deformation and recovery, causing no defects (for example, observation of deformation traces and the like) before and after deformation, having excellent cuttability and workability, and causing no lifting, delamination, and/or bubble generation, and a use thereof.