Pressure Sensitive Adhesive for Heat Dissipating Element Assembly
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Solution Overview
Problem
Conventional methods for assembling heat generating and heat dissipating elements in power supplying units are complex, require excessive space, and involve high manufacturing costs due to screw-nut assemblies and high-temperature thermosetting adhesive processes, which complicate automation and increase the risk of component malfunctions.
Innovation Solution
A method utilizing a pressure sensitive element with distinct release films and connecting strengths to securely attach heat generating elements to a heat dissipating element without screws, using a thermal-resistant, electrically insulating, and heat conductive silicone-based pressure sensitive layer, eliminating the need for high-temperature processing and reducing manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If screw-nut assembly is used to assemble heat generating element and heat dissipating plate, then connection strength is improved, but device complexity and space requirement increase
Solution Approach 1:
The patent removes the complex screw-nut assembly and insulating plate components, extracting only the essential function of mechanical fastening. The pressure-sensitive adhesive layer directly bonds the heat generating element to the heat dissipating plate without requiring separate fastening components, thereby reducing device complexity while maintaining connection strength.
Solution Approach 2:
The patent combines multiple functions into a single pressure-sensitive adhesive layer: mechanical fastening, electrical insulation, and thermal conduction. This merging eliminates the need for separate screws, insulating plates, and adhesive layers, simplifying the assembly structure while achieving the same or better performance.
2Device complexity
If thermosetting adhesive layer is used to replace screws, then device complexity is reduced, but manufacturing cost and time increase due to high-temperature heating requirement
Solution Approach 1:
The patent replaces the thermal curing process (heating system) with a mechanical pressure-sensitive bonding mechanism. The pressure-sensitive adhesive layer bonds immediately upon application without requiring high-temperature heating furnaces, eliminating the time-consuming thermosetting process while maintaining strong adhesion.
Solution Approach 2:
The pressure-sensitive adhesive layer is pre-formulated to provide immediate bonding strength upon application, eliminating the need for subsequent heating or curing steps. The adhesive is prepared in advance with the correct properties to bond effectively at room temperature, saving manufacturing time.
3Reliability
If insulating plate and insulating washer are included for insulation, then electrical insulation is improved, but device complexity and assembling difficulty increase
Solution Approach 1:
The patent combines electrical insulation and thermal conduction functions into a single pressure-sensitive adhesive layer. The adhesive material is specifically selected to provide both electrical insulation properties and thermal conduction properties, eliminating the need for separate insulating plates and washers while reducing the total number of components.
Solution Approach 2:
The pressure-sensitive adhesive layer serves multiple functions simultaneously: mechanical fastening, electrical insulation, thermal conduction, and shock absorption. This multi-functional design eliminates the need for multiple specialized components, simplifying the assembly while maintaining or improving overall performance.
4Strength
If heat dissipating plate is bored for screws, then connection strength is improved, but harmful factors increase due to metal scraps falling on electronic components
Solution Approach 1:
The patent removes the screw fastening process entirely, eliminating the need to bore holes in the heat dissipating plate. The pressure-sensitive adhesive layer bonds the components together without requiring any penetration or hole-making operations, thereby preventing metal scraps from contaminating electronic components.
Solution Approach 2:
The pressure-sensitive adhesive layer acts as an intermediary bonding medium between the heat generating element and the heat dissipating plate, replacing the need for mechanical fasteners that require hole penetration. This intermediary approach achieves strong bonding without the harmful side effects of drilling operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the assembly process, saves space, reduces production costs, and enhances manufacturing efficiency by allowing for automated assembly without the need for screws or high-temperature furnaces, while ensuring effective heat dissipation and electrical insulation.
Implementation Method 1
a pressure sensitive layer (20) having opposite first and second connecting surfaces (21, 22)... the second connecting surface (22) being in contact with the adhered side (10)
Implementation Method 2
a pressure sensitive element (2) including: a pressure sensitive layer (20) having opposite first and second connecting surfaces (21, 22)
Data Source
AI summary
A method for assembling a heat generating element and a heat dissipating element includes: preparing a pressure sensitive element including a pressure sensitive layer and first and second release films connected to the pressure sensitive layer; separating the second release film from the pressure sensitive layer and then adhering a heat dissipating element to the pressure sensitive layer; forcing the first release film; separating the first release film from the pressure sensitive layer, and then adhering a heat generating element to the pressure sensitive layer; and fixedly attaching the heat generating element onto the pressure sensitive layer. A pressure sensitive element and a power supplying unit are also disclosed.