Pressure Sensor Alignment Structures for Automated Assembly
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Solution Overview
Problem
Pressure sensors with small form factors face challenges in automated assembly due to size constraints, making traditional semiconductor assembly tools unsuitable, and manual assembly techniques costly and laborious.
Innovation Solution
The development of pressure sensor systems that include alignment structures such as wire combs, spacers, and modified insulation layers to facilitate automated assembly processes, allowing for precise alignment and attachment of wires to bondpads, along with blocking structures to control epoxy flow and prevent damage to sensitive components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If pressure sensors are made small to achieve a compact form factor, then the device size is reduced, but automated assembly becomes difficult and manual assembly is required
Solution Approach 1:
The patent introduces an alignment structure as an intermediary component between the pressure sensor and the wire bonding tool. This alignment structure provides reference features that enable automated positioning and alignment of the small pressure sensor during assembly, bridging the gap between miniaturization and automated manufacturing capability
Solution Approach 2:
The alignment structure is pre-formed as part of the pressure sensor package, providing predetermined alignment features before the automated assembly process begins. This preliminary preparation enables automated tools to quickly and accurately position wires without requiring complex real-time adjustment mechanisms
2Extent of automation
If traditional semiconductor assembly tools are used for wire bonding, then automated assembly is achieved, but small pressure sensors cannot be properly aligned and attached
Solution Approach 1:
The alignment structure serves as a mediator between the automated wire bonding tool and the pressure sensor bondpads. It provides mechanical reference features that the automated tool can use to achieve precise alignment, translating the tool's positioning capabilities into accurate wire-to-bondpad alignment
Solution Approach 2:
The alignment structure changes the geometric parameters of the assembly interface by providing reference features with known dimensions and positions. This allows the automated tool to use standard positioning tolerances to achieve the required wire-to-bondpad alignment precision
3Reliability
If epoxy is applied to cover bondpads for protection, then component protection is improved, but epoxy overflow can damage sensitive components
Solution Approach 1:
The patent extracts or removes the harmful effect of epoxy overflow by providing a blocking structure that prevents epoxy from reaching sensitive components. The blocking structure acts as a barrier that separates the epoxy application zone from the sensitive device identifier area
Solution Approach 2:
The blocking structure serves as an intermediary barrier between the epoxy and sensitive components. It allows the epoxy to be applied for bondpad protection while preventing it from causing damage to the device identifier or other sensitive areas
Data Source
AI summary
Pressure sensors and associated structures that may have reduced light sensitivity. An example may provide structures reducing light at a component on a membrane of a pressure sensor.