Pressure Sensor Array With Printed Conductive Ink Interconnects
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Solution Overview
Problem
Conventional electronic pressure sensors are cumbersome to attach to application substrates, requiring adhesive and conductive glue, which complicates the attachment process.
Innovation Solution
An electronic pressure sensor array with conductive electrodes and interconnects formed on a substrate, featuring a pressure-sensitive conductive substrate, dielectric layers, and conductive ink electrodes, allowing for easy alignment and attachment without adhesives, using conductive ink for electrodes and interconnects, and a method of fabrication that includes printing and lamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional pressure sensors with straight wires and adhesive are used, then pressure sensing function is achieved, but attachment process becomes complex and time-consuming
Solution Approach 1:
The patent merges the pressure sensing element, electrodes, and interconnects into a single integrated sensor assembly. The conductive traces are printed directly on the substrate and connected to the pressure sensing element, eliminating the need for separate wire attachments and adhesive applications. This integration allows the entire sensor to be attached as one unit to the application substrate, dramatically simplifying the attachment process.
Solution Approach 2:
The patent replaces traditional mechanical attachment methods (adhesive application, wire bonding, curing processes) with a printed circuit board approach where conductive traces are directly printed on the substrate. This substitution eliminates the need for mechanical assembly steps involving adhesives and wire attachments, reducing both process complexity and time requirements.
2Reliability
If multiple attachment steps with adhesive and conductive glue are used, then electrical connection is achieved, but manufacturing time and process complexity increase
Solution Approach 1:
The patent combines the electrical connection function with the structural substrate by printing conductive traces directly onto the substrate surface. This merging of functions eliminates the need for separate conductive glue application and curing steps, maintaining reliable electrical connections while significantly improving manufacturing efficiency.
Solution Approach 2:
The conductive traces are pre-printed on the substrate during the substrate fabrication process, before the sensor assembly is completed. This preliminary action ensures that electrical connections are already established and positioned correctly, eliminating the need for subsequent attachment steps involving conductive adhesives and their associated curing times.
3Reliability
If straight wires are used for electrical connection, then electrical conductivity is achieved, but attachment difficulty and process burden increase
Solution Approach 1:
The patent replaces traditional wire-based electrical connections with printed conductive traces on the substrate. This substitution maintains reliable electrical conductivity while eliminating the manual attachment operations required for wire connections, making the manufacturing process much easier and more suitable for automated production.
Solution Approach 2:
The patent transitions from three-dimensional wire connections to two-dimensional printed traces on the substrate surface. This dimensional change simplifies the attachment process by eliminating the need to manually position and connect wires, while maintaining electrical conductivity through the printed conductive pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies the attachment process and enhances the accuracy of pressure measurement by enabling current flow through the pressure-sensitive substrate in response to applied pressure, facilitating efficient integration into larger circuits and arrays.
Implementation Method 1
The pressure sensor conductive substrate has a resistivity that changes with applied pressure
Data Source
AI summary
An electronic pressure sensor array has a plurality of conductive electrodes and interconnects selectively formed on a pressure sensor substrate to form a plurality of individual pressure sensor assemblies. The individual pressure sensor assemblies can be aligned in various configurations to form the electronic pressure sensor array. Each pressure sensor assembly is made of a plurality of layers including a pressure sensor substrate, insulating layers on either side of the pressure sensor substrate, and conductive ink layers on an outer surface of each insulating layer. A cavity is formed in each insulating layer, the cavity in one insulating layer being vertically aligned with the cavity in the other insulating layer, and conductive ink fills each cavity to form electrodes.