Pressure Sensor Buffer Bumps Prevent Hot-Press Shift
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Solution Overview
Problem
Existing pressure sensing devices face errors in sensitivity due to excessive relative shifts of circuit structures during the hot-pressing process, which can cause inaccurate pressure sensing.
Innovation Solution
The pressure sensing device incorporates buffer units with buffer bumps or walls between conductive units and pressure sensing blocks, and a release layer with higher hardness than the packaging layer to prevent excessive tight connections, ensuring each pressure sensing block remains in a preset uncompressed state during packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a layer of sealing film is hot-pressed or roller hot-pressed at the substrate and the pressure sensing blocks to form the pressure sensing device, then the pressure sensing device can be sealed and packaged, but excessive relative shifts may be generated for the positions of the circuit structures in some pressure sensing blocks, which may easily cause errors in the sensitivity of the pressure sensing device sealed
Solution Approach 1:
The patent introduces a release layer as an intermediary component between the packaging layer and the pressure sensing blocks. This release layer has a hardness greater than that of the packaging layer, allowing it to act as a protective mediator during the hot-pressing process. The release layer prevents direct contact between the packaging layer and the circuit structures, thereby avoiding excessive relative shifts and position errors while still enabling effective sealing.
Solution Approach 2:
The release layer is positioned in advance before the hot-pressing process to cushion and protect the pressure sensing blocks and circuit structures from excessive pressure. By having this protective layer in place beforehand, the patent prevents potential damage and position shifts during sealing, ensuring manufacturing precision is maintained throughout the packaging process.
2Ease of manufacture
If the packaging layer is directly bonded to the substrate and pressure sensing blocks, then the sealing process can be completed, but the pressure sensing blocks may be subjected to excessive compression during hot-pressing, causing position shifts and sensitivity errors
Solution Approach 1:
The release layer serves as a mediator between the packaging layer and the pressure sensing blocks during the hot-pressing process. It allows the packaging layer to be effectively bonded to the substrate while preventing excessive compression forces from being transmitted to the pressure sensing blocks, thereby maintaining measurement precision without complicating the manufacturing process.
Solution Approach 2:
The patent utilizes the hardness parameter difference between the release layer and the packaging layer to achieve the desired effect. By selecting a release layer with greater hardness than the packaging layer, the system enables effective sealing while controlling the compression forces applied to the pressure sensing blocks, thus maintaining both ease of manufacture and measurement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This arrangement maintains accurate pressure sensing sensitivity by preventing excessive connection of pressure sensing blocks to electrodes, allowing for precise resistance changes and current flow based on pressure, enabling reliable pressure measurement.
Implementation Method 1
Each buffer unit is arranged between the corresponding each of the conductive units and each of the pressure sensing blocks, and each of the buffer units comprises a plurality of buffer bumps arranged in an array at the first electrode and the second electrode of the corresponding each of the conductive units
Implementation Method 2
a layer of sealing film is finally hot-pressed or roller hot-pressed at the substrate and the pressure sensing blocks to form the pressure sensing device
Data Source
AI summary
A pressure sensing device includes a substrate, at least a pressure sensing module, and a packaging layer. The pressure sensing module is arranged at the substrate including a plurality of conductive units, a plurality of pressure sensing blocks and a plurality of buffer units. Each conductive unit has a first electrode and a second electrode. The pressure sensing blocks are respectively arranged at the conductive units. Each pressure sensing block has a circuit structure that electrically connects the first electrode and the second electrode of each corresponding conductive unit. Each buffer unit is arranged between each corresponding conductive unit and each corresponding pressure sensing block comprising a plurality of buffer bumps arranged in an array at the first electrode and the second electrode of each corresponding conductive units. The packaging layer is bonded to the substrate, the conductive units and the pressure sensing blocks.