Pressure Sensor Diaphragm Gauge Layout for Crosstalk Reduction

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Solution Overview

Problem

Existing pressure sensors face challenges in achieving a compact, high-performance design due to the need for strain dividers and nonbonded regions, which increase sensor size and complicate temperature characterization.

Innovation Solution

The design incorporates a differential pressure diaphragm at the sensor's center with strategically positioned differential and static pressure gauges, and nonbonded regions on the pedestal, optimizing gauge placement to prevent crosstalk and enhance temperature stability while maintaining a compact form factor.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If strain dividers are formed between differential pressure strain gauges and static pressure strain gauges to prevent crosstalk, then measurement precision is improved, but the sensor chip size increases

Engineering Contradiction:
Improvepressure measurement precisionVSAvoidsensor chip area
Core Design Contradiction:
Measurement precisionVSArea of stationary object

Solution Approach 1:

The sensor chip is divided into functionally independent regions: a central differential pressure detection area and peripheral static pressure detection areas. This segmentation allows the differential pressure gauges to be isolated from static pressure influences without requiring strain dividers, thereby maintaining measurement precision while reducing overall chip area.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The harmful stress transmission path is extracted and eliminated by positioning static pressure diaphragms and gauges in separate peripheral regions away from the central differential pressure diaphragm. This spatial extraction removes the need for strain dividers that would otherwise be required to block stress transmission.

Inventive Principle:
Principle #2Taking out (Extraction)

2Reliability

If nonbonded regions are provided at the corners of the sensor chip to minimize temperature-induced zero shift, then temperature characteristics are improved, but securing space for these regions becomes difficult in compact designs

Engineering Contradiction:
Improvetemperature characteristicsVSAvoidsensor chip area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

Nonbonded regions are strategically positioned at specific corner locations where they provide maximum temperature compensation benefit with minimal impact on overall device footprint. The pedestal structure is designed with localized nonbonded areas at corners while maintaining bonded connections in central and peripheral regions, achieving temperature stability without excessive area consumption.

Inventive Principle:
Principle #3Local quality

3Area of stationary object

If the sensor chip is made compact to reduce size, then the sensor becomes more portable and space-efficient, but sufficient space for strain dividers and nonbonded regions cannot be secured

Engineering Contradiction:
Improvesensor chip areaVSAvoidpressure measurement precision
Core Design Contradiction:
Area of stationary objectVSMeasurement precision

Solution Approach 1:

The design transitions from a planar arrangement where strain dividers would be needed between gauges to a three-dimensional configuration with stacked differential and static pressure diaphragms. By utilizing vertical stacking and peripheral positioning, the solution achieves compact footprint while maintaining the functional separation needed for precise measurements.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for accurate measurement of both static and differential pressures with improved temperature characteristics, reducing stress interference and enabling a more compact, high-performance pressure sensor.

Implementation Method 1

pressure sensors that take advantage of a semiconductor's piezoresistive effect

Methodology Applied
Scientific EffectPiezoresistive effect: Piezoresistive Effect

Data Source

PatentUS8042400B2Pressure sensor
Publication Date: 2011.10.25 AZBIL CORP
  • US8042400B2 patent drawing
  • US8042400B2 patent drawing
  • US8042400B2 patent drawing

AI summary

A pressure sensor according to the present invention comprises: a differential pressure diaphragm, which is provided to a center part of a sensor chip; a differential pressure gauge, which is provided to a perimeter edge part of the differential pressure diaphragm and is formed in radial directions; a differential pressure gauge, which is disposed at a position at which it opposes the differential pressure gauge and, together with the first differential pressure gauge, sandwiches the differential pressure diaphragm and is formed in perimeter directions, which are perpendicular to the radial directions; a differential pressure gauge, which is provided in the vicinity of the differential pressure gauge and is provided in the perimeter directions; a differential pressure gauge, which is disposed at a position at which it opposes the differential pressure gauge and, together with the differential pressure gauge, sandwiches the differential pressure diaphragm and is formed in the radial directions; a static pressure diaphragm, which is disposed at a position that lies in the perimeter directions between the differential pressure gauge and the differential pressure gauge; and a static pressure diaphragm, which is disposed at a position at which it opposes the static pressure diaphragm and, together with the static pressure diaphragm, sandwiches the differential pressure diaphragm.