Pressure Sensor Finger Circuit Density Variation
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Solution Overview
Problem
Conventional pressure sensors are less sensitive to high pressures, limiting their applicable range and effectiveness in detecting pressure variations.
Innovation Solution
A pressure sensor design that includes a conductive substrate, ring-shaped spacer, and sensing circuit substrate with a central sensing region and outer sensing regions, featuring a denser staggered arrangement of finger circuits in the central sensing region and a less dense arrangement in the outer sensing regions, enhancing sensitivity at high pressures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a conventional pressure sensor with uniform finger circuit arrangement is used, then the device structure is simple and easy to manufacture, but the sensitivity at high pressures is insufficient and the detection range is limited
Solution Approach 1:
The patent applies local quality by creating different finger circuit arrangements in different regions: the central sensing region has a denser staggered arrangement of finger circuits while the outer sensing regions have a less dense arrangement. This non-uniform local configuration optimizes sensitivity specifically for high-pressure detection in the central region while maintaining overall device functionality.
Solution Approach 2:
The sensing area is segmented into distinct regions: a central sensing region with higher density finger circuits and outer sensing regions with lower density finger circuits. This segmentation allows each region to be optimized for its specific function, with the central region providing enhanced high-pressure sensitivity.
2Measurement precision
If the finger circuits are arranged densely throughout the entire sensing area, then the sensitivity at high pressures is improved, but the device complexity increases and manufacturing becomes more difficult
Solution Approach 1:
Instead of uniformly dense finger circuits across the entire sensing area, the patent implements local quality by concentrating the denser finger circuit arrangement specifically in the central sensing region where high-pressure detection is most critical, while maintaining a less dense arrangement in the outer regions, thus balancing sensitivity improvement with manufacturing feasibility.
Solution Approach 2:
The sensing area is divided into segments with different densities: the central sensing region contains densely arranged finger circuits for high-pressure detection, while the outer sensing regions contain sparsely arranged finger circuits. This segmentation reduces overall manufacturing complexity compared to a fully dense configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly increases the variation percentage for high-pressure detection, achieving higher sensitivity and expanding the detection range compared to conventional sensors.
Implementation Method 1
as an object depresses at the conductive substrate PA1 or the sensing circuit substrate PA4, then the first sensing circuit PA42 and the second sensing circuit PA43 would individually and electrically connect the conductive layer PA12, such that the first sensing circuit PA42 and the second sensing circuit PA43 would be connected, and a corresponding voltage variation would be generated
Data Source
AI summary
A pressure sensor includes a conductive substrate, a ring-shaped spacer, an inner spacer and a sensing circuit substrate. The conductive substrate includes a conductive-substrate body and a conductive layer. The conductive layer is disposed on the conductive-substrate body. The ring-shaped spacer and the inner spacer are disposed on the conductive-substrate body. The sensing-circuit substrate, disposed on the ring-shaped spacer and the inner spacer, includes a circuit-substrate body, a first sensing circuit and a second sensing circuit. The first sensing circuit and the second sensing circuit are disposed on opposing sides of the circuit-substrate body, and a plurality of first finger circuits of the first sensing circuit and a plurality of second finger circuits of the second sensing circuit are interlaced. The first sensing circuit and the second sensing circuit are densely arranged at the center of the conductive layer and less densely arranged on both sides of the conductive layer.