Pressure Sensor Signal Processing Assembly With Horizontal Layout
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Solution Overview
Problem
Existing pressure sensors face challenges in efficiently and accurately bonding the circuit boards due to the perpendicular orientation of the elastic diaphragm, requiring specialized equipment even for precise alignment.
Innovation Solution
A signal processing assembly with a transverse plate, longitudinal plate, and conductive connecting portions is used to connect the integrated signal processing circuit with the pressure measurement circuit, employing a mounting seat with accommodating grooves and flexible plates for efficient assembly and riveting, eliminating the need for glue bonding and allowing horizontal circuit alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the circuit boards are set vertically to reduce lateral size, then the lateral size is reduced, but the bonding process becomes difficult to complete efficiently and accurately
Solution Approach 1:
The patent changes the orientation of the circuit board from vertical to horizontal arrangement. The circuit board is laid out horizontally with the Wheatstone bridge circuit positioned on the left side and the signal processing circuit on the right side, allowing the elastic diaphragm to remain perpendicular to the pressure joint while enabling efficient and accurate bonding processes.
2Manufacturing precision
If a specially customized device is used for bonding, then bonding accuracy is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
Instead of using complex customized bonding equipment to achieve precision, the patent inverts the approach by redesigning the circuit board layout and orientation. The horizontal arrangement of the circuit board with properly positioned connection points allows standard bonding equipment to achieve accurate results without requiring specially customized devices.
3Measurement precision
If the elastic diaphragm is positioned perpendicular to the pressure joint, then pressure measurement accuracy is improved, but the circuit board arrangement becomes constrained
Solution Approach 1:
The patent resolves the constraint by changing the spatial arrangement from a vertical configuration to a horizontal configuration. The circuit board is arranged horizontally with the Wheatstone bridge on the left and signal processing circuit on the right, allowing the elastic diaphragm to maintain its perpendicular orientation to the pressure joint while providing sufficient space for circuit connections and signal processing components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates efficient connection of the signal processing circuit with the pressure measurement circuit, reducing lateral size for applications in small spaces and improving production efficiency while ensuring accurate bonding without specialized equipment.
Implementation Method 1
a first flexible plate, a second flexible plate and a first conductive connecting portion connected in sequence; wherein the transverse plate, the longitudinal plate and the first conductive connecting portion are provided in sequence from near to far; and the first conductive connecting portion is electrically connected to a pressure measuring circuit
Data Source
AI summary
Disclosed are a signal processing assembly for a pressure sensor and a pressure sensor. The signal processing assembly for the pressure sensor includes a horizontal plate, a first flexible plate, a longitudinal plate, a second flexible plate and a first conductive connecting portion connected in sequence. The horizontal plate, the longitudinal plate and the first conductive connecting portion are provided in sequence from near to far; the first conductive connecting portion is electrically connected to the pressure measurement circuit, and the pressure measurement circuit is provided at a horizontal plane located at a distal side of the first conductive connecting portion, so as to well connect the signal processing circuit and the pressure measurement circuit.