Pressure Sensor Module with Integrated Passive Devices
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Solution Overview
Problem
Existing pressure sensor modules face challenges in miniaturization and securing reliability when connected to customer connection terminals, particularly in applications like airbag systems and tire pressure monitoring systems.
Innovation Solution
The integration of a pressure sensor chip and one or more integrated passive devices (IPD) or discrete passive devices within a common housing, with external contact elements for secure electrical connections, allows for miniaturization and improved reliability by eliminating the need for a printed circuit board and enabling direct attachment to customer-side terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a printed circuit board is used to connect pressure sensor and additional electrical devices, then signal processing capability is improved, but module size increases
Solution Approach 1:
The patent combines the pressure sensor chip and additional electrical devices (such as IPD chips) into a single integrated module housed together, eliminating the need for a separate printed circuit board. This merging of components directly reduces module size while maintaining signal processing capability through direct electrical connections between components.
2Ease of operation
If traditional connection terminals are used, then ease of connection is improved, but connection reliability deteriorates
Solution Approach 1:
The connection system is segmented into two parts: simplified connection elements on the sensor module side and corresponding connection terminals on the customer side. This segmentation allows the sensor module to have simple, easy-to-connect elements while the customer side can provide robust, reliable terminals, thus resolving the contradiction between ease of connection and connection reliability.
Data Source
AI summary
A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.