Pressure Sensor Metal Inner Frame Resin Housing Vibration
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Solution Overview
Problem
Existing pressure sensors in brake systems are prone to connection failures due to vibrations, require complex assembly processes, and have high manufacturing costs due to their small size and precision requirements, leading to potential defects.
Innovation Solution
A pressure sensor design featuring a metal inner frame with a printed circuit board assembly and a resin housing, where the inner frame is mechanically fastened to the housing, and includes a chamfered portion for alignment and locking features to secure the sensor element, reducing the risk of disconnection and simplifying assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a typical pressure sensor is mounted on a machining hole and electrically connected through a separate connector and cable, then the sensor can be electrically connected to the circuit board, but the connection may be separated during large vibrations, causing contact failure and signal destabilization
Solution Approach 1:
The patent merges the electrical connection function into the housing structure itself. The housing includes a through-hole with a connection terminal that is directly integrated into the housing, eliminating the need for separate connectors and cables. This integration ensures that the electrical connection remains stable during vibrations since the connection is built into the structural housing rather than being a separate assembly.
Solution Approach 2:
The housing acts as an intermediary structure that provides both mechanical support and electrical connection. The connection terminal integrated into the housing serves as a mediator between the sensor element and the circuit board, ensuring reliable electrical connection while withstanding vibration forces through the housing's structural integrity.
2Volume of moving object
If the pressure sensor includes multiple parts and has a small size, then the sensor can be compact, but the component assembly process becomes complicated and manufacturing defects increase
Solution Approach 1:
The patent combines multiple functions into the housing structure. The housing provides mechanical enclosure, electrical connection (through integrated connection terminals), and positioning functions. This merging of functions reduces the number of separate components needed, simplifying the assembly process while maintaining a compact sensor size.
Solution Approach 2:
The housing is designed as a multi-functional component that serves as both the structural enclosure and the electrical connection interface. The through-hole in the housing serves dual purposes: providing mechanical access and housing the connection terminal for electrical connection. This multi-functionality reduces overall device complexity despite the small size.
3Manufacturing precision
If the pressure sensor is a precision part requiring accurate assembly, then the sensor performance is maintained, but manufacturing costs increase significantly
Solution Approach 1:
By integrating the connection terminal into the housing structure, the patent reduces the number of precision assembly steps required. Instead of requiring precise alignment of separate connectors and cables, the integrated design allows for simpler assembly operations, reducing manufacturing costs while maintaining acceptable precision levels.
Solution Approach 2:
The patent segments the sensor into distinct functional modules: the sensor element, the housing with integrated connection terminals, and the PCB assembly. This segmentation allows for modular manufacturing and assembly, reducing the overall precision requirements and manufacturing complexity compared to fully integrated designs, thereby lowering costs.
Data Source
AI summary
A pressure sensor includes a sensor element, an inner frame configured to receive at least a portion of the sensor element, and a housing configured to receive the inner frame therein. The inner frame is formed of a metal material and includes a printed circuit board assembly to be electrically connected to the sensor element. The housing is formed of a resin material.