Pressure Sensor Package Lid Sealing With Minimal Gel
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Solution Overview
Problem
Conventional pressure sensors designed for liquid environments require a significant amount of gel material for sealing, which increases manufacturing costs and potential defects.
Innovation Solution
A semiconductor package design that uses a cover lid with a centered opening sealed with a minimal amount of gel material, typically silicone, to environmentally seal the sensing region, reducing the need for excessive gel while maintaining a waterproof seal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If gel material is used to seal the sensing region from the external environment, then waterproof sealing is achieved, but manufacturing cost increases and potential defects increase due to considerable amount of gel material required
Solution Approach 1:
The patent applies this principle by using a thin film of gel material deposited only on the bottom surface of the cover lid, rather than using a considerable amount of gel material as in conventional designs. This thin film is sufficient to provide waterproof sealing while significantly reducing material usage and manufacturing cost.
Solution Approach 2:
The patent extracts the gel material sealing function to only where it is absolutely necessary - the bottom surface of the cover lid. By removing gel material from other areas and using alternative sealing methods (such as sealing structures integrated into the cover lid or substrate), the design achieves waterproof sealing with minimal gel material.
2Reliability
If gel material is used to seal the sensing region, then environmental sealing is achieved, but the quantity of gel material increases leading to higher cost and defects
Solution Approach 1:
The patent uses a thin film of gel material deposited on the bottom surface of the cover lid, which provides environmental sealing with minimal material quantity. This thin film approach maintains sealing effectiveness while dramatically reducing the volume of gel material required compared to conventional designs.
Solution Approach 2:
The patent applies local quality by concentrating gel material only on the bottom surface of the cover lid where sealing is most critical, rather than uniformly distributing gel material throughout the sensing region. This localized approach provides effective environmental sealing with reduced overall material quantity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces manufacturing costs and defects by using substantially less gel material while maintaining the ability to sense external pressure in liquid environments effectively.
Implementation Method 1
A gel material 88 is deposited around semiconductor die 70 to seal off sensing area 78 from the external environment, such as water
Implementation Method 2
sensing area 76 has a transducer that is responsive to external pressure by bending or deforming and generating an electrical signal proportional to the applied external pressure
Data Source
AI summary
A semiconductor device has a substrate and a first electrical component including a sensing region disposed over the substrate. The sensing region can be responsive to external stimuli, such as pressure. A cover lid is disposed over the first electrical component and extending to the substrate with an opening in the cover lid aligned over the sensing region. A gel material is disposed within the opening of the cover lid to seal the sensing region with respect to an environment condition, such as liquid. A bond wire is coupled between the first electrical component and substrate. An adhesive layer is disposed around a perimeter of the sensing area and the cover lid is bonded to the adhesive layer. A second electrical component is disposed on the substrate and the first electrical component is disposed on the second electrical component.