Pressure Sensor Package Lead Frame Cost Reduction
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Solution Overview
Problem
Conventional pressure sensor package structures have high production costs due to the use of expensive ceramic substrates and metal caps, necessitating a cost-effective alternative.
Innovation Solution
A pressure sensor package design utilizing a package lead frame made of molding plastic with lead frame units and a sidewall of metal or resin material, encapsulated with packaging silicone, replacing the conventional ceramic substrate and metal cap, and electrically connecting the pressure sensor module via metal wires or flip-chip process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ceramic substrate and metal cap are used in conventional pressure sensor package structures, then structural integrity and reliability are improved, but production cost increases significantly
Solution Approach 1:
The patent replaces expensive ceramic substrates and metal caps with a lead frame structure made of metal and molding compound. The lead frame serves as both the structural support and the mounting substrate for the pressure sensing module, eliminating the need for separate ceramic substrate and metal cap components. This substitution with cheaper materials achieves the same structural integrity function at lower production cost.
Solution Approach 2:
The patent integrates multiple functions into the lead frame structure. The lead frame simultaneously provides structural support, electrical connectivity, and mounting functionality that were previously distributed across ceramic substrate, metal cap, and separate lead frames. This merging of functions reduces component count and overall manufacturing cost while maintaining reliability.
2Reliability
If ceramic substrate and metal cap are used in conventional pressure sensor package structures, then structural integrity is improved, but manufacturing complexity increases
Solution Approach 1:
The patent extracts and eliminates the ceramic substrate and metal cap from the package structure, retaining only the essential lead frame and molding compound components. This extraction simplifies the manufacturing process by removing complex high-temperature ceramic bonding steps and reducing the number of assembly operations required.
Solution Approach 2:
The lead frame is designed to perform multiple functions: providing structural support, establishing electrical connections, and serving as the mounting platform for the pressure sensing module. This multi-functionality reduces the overall device complexity by eliminating separate components that would otherwise be needed for each function.
Data Source
AI summary
A pressure sensor package includes a package lead frame including a molding plastic layer with a top surface and a plurality of lead frame units mounted in the molding plastic layer, a sidewall disposed on the top surface of the molding plastic layer and surrounding a receiving chamber, a pressure sensor module mounted on the top surface of the molding plastic layer and disposed in the receiving chamber, and a packaging silicone mounted in the receiving chamber to encapsulate the pressure sensor module.