Pressure Sensor Module With Segmented Diaphragm Assembly
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Solution Overview
Problem
Conventional sensor modules face issues with poor PCB assembly stability, difficulty in processing thin diaphragms for increased sensitivity, oxide film formation due to high-temperature bonding, and susceptibility to damage from rotational forces, among other challenges.
Innovation Solution
The sensor module design includes a pressure sensing part with a diaphragm and strain gauges separated for easier processing, ground pins for stability, and a snubber to alleviate pulsation pressure, along with separate PCB substrates for accurate assembly and reduced thermal strain.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the diaphragm and body are processed as a single body structure, then leak prevention is improved, but processing difficulty increases and sensing sensitivity cannot be enhanced
Solution Approach 1:
The patent divides the pressure sensing element into separate components: a diaphragm and a body, which are assembled together rather than processed as a single body. This segmentation allows the diaphragm to be processed as a thin film for increased sensing sensitivity while the body provides structural support and leak prevention, resolving the contradiction between reliability and ease of manufacture.
2Strength
If the strain gauge is bonded to the diaphragm using high-temperature firing, then bonding strength is improved, but oxide film formation occurs on the outer appearance
Solution Approach 1:
The patent extracts the harmful effect of high-temperature firing by using alternative bonding methods such as adhesive bonding or low-temperature sintering. This allows the strain gauge to be bonded to the diaphragm with sufficient bonding strength while avoiding the oxide film formation that occurs with conventional high-temperature firing processes.
3Device complexity
If circular components are coupled inside a cylindrical case, then assembly is simplified, but rotational force can damage internal PCB components
Solution Approach 1:
The patent applies preliminary action by providing preventive measures against rotational damage before it occurs. Ground pins are installed in advance to create a grounding path that protects internal PCB components from damage caused by rotational forces during assembly or operation, thus maintaining both assembly simplicity and component reliability.
4Reliability
If adhesive bonding is used to prevent component damage and maintain airtightness, then sealing is improved, but quantitative quality control becomes difficult due to variable adhesive application
Solution Approach 1:
The patent addresses quality control issues by changing the parameters of adhesive application through standardized processes, controlled adhesive viscosity, precise dispensing equipment, and optimized curing conditions. This ensures consistent adhesive amount and distribution, maintaining both airtightness and quantitative quality control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances assembly precision, reduces oxide film formation, minimizes damage from rotational forces, and improves sensitivity and durability by ensuring linear strain distribution and reduced thermal drift.
Implementation Method 1
one or more strain gauges placed on the sensing surface to sense a change in pressure transmitted through the communication hole
Data Source
AI summary
A sensor module according to an embodiment of the present disclosure includes a pressure sensing part for sensing pressure; at least one or a plurality of PCB substrates for receiving the pressure signal sensed by the pressure sensing part, processing the pressure signal, and then outputting the signal; and a case accommodating the at least one or a plurality of PCB substrates and coupled to an upper end of the pressure sensing part; in which the pressure sensing part includes a sensing port in which a communication hole for pressure transmission is formed; and a pressure sensing element placed on an inner upper side of the sensing port and sensing a change in pressure transmitted through the communication hole; the pressure sensing element includes a diaphragm including a horizontal sensing surface and a support part extending vertically from an edge of the sensing surface; and one or more strain gauges placed on the sensing surface to sense a change in pressure transmitted through the communication hole; and the outer circumferential surface of the support part is formed with a groove recessed to a predetermined depth.